LUP Statistics
Record
- Title
- Inductive Coupling Emissions between Bond Wires in Integrated Circuits
- Type
- Student Paper
- Publ. year
- 2019
- Author/s
- Nurdal, Erman; Beldin, Gabriel
- Department/s
- Department of Electrical and Information Technology
- In LUP since
- 2020-01-13
Downloads
| Total | This Year | This Month |
| 284 | 12 | 6 |
United States of America  |
45 (16%) |
Sweden  |
38 (13%) |
Taiwan (China)  |
26 (9%) |
Germany  |
25 (9%) |
China  |
14 (5%) |
France  |
13 (5%) |
India  |
11 (4%) |
Japan  |
10 (4%) |
United Kingdom of Great Britain and Northern Ireland  |
7 (2%) |
Netherlands  |
6 (2%) |
South Korea  |
6 (2%) |
Hong Kong (China)  |
6 (2%) |
Switzerland  |
5 (2%) |
Iran  |
5 (2%) |
Belgium  |
4 (1%) |
Australia  |
4 (1%) |
Egypt  |
3 (1%) |
Turkey  |
3 (1%) |
Russian Federation  |
3 (1%) |
Italy  |
3 (1%) |
Spain  |
3 (1%) |
Hungary  |
3 (1%) |
Greece  |
2 (1%) |
Viet Nam  |
2 (1%) |
Iraq  |
2 (1%) |
Poland  |
2 (1%) |
Canada  |
2 (1%) |
New Zealand  |
2 (1%) |
Finland  |
2 (1%) |
Algeria  |
2 (1%) |
Israel  |
2 (1%) |
Albania  |
2 (1%) |
Armenia  |
2 (1%) |
Romania  |
2 (1%) |
Singapore  |
2 (1%) |
Unknown  |
2 (1%) |
Mexico  |
1 (0%) |
Latvia  |
1 (0%) |
Thailand  |
1 (0%) |
Bulgaria  |
1 (0%) |
Indonesia  |
1 (0%) |
Czechia  |
1 (0%) |
Argentina  |
1 (0%) |
Ukraine  |
1 (0%) |
Chile  |
1 (0%) |
Tunisia  |
1 (0%) |
Serbia  |
1 (0%) |
Austria  |
1 (0%) |
Malaysia  |
1 (0%) |