LUP Statistics
Record
- Title
- Test Planning for Core-based 3D Stacked ICs with Through-Silicon Vias
- Type
- Conference Proceeding/Paper
- Publ. year
- 2012
- Author/s
- Sengupta, Breeta; Ingelsson, Urban; Larsson, Erik
- Department/s
- Department of Electrical and Information Technology; Digital ASIC-lup-obsolete
- In LUP since
- 2016-04-04
Downloads
| Total | This Year | This Month |
| 607 | 4 | 0 |
United States of America  |
251 (41%) |
India  |
82 (14%) |
China  |
49 (8%) |
Germany  |
30 (5%) |
Taiwan (China)  |
29 (5%) |
South Korea  |
21 (3%) |
France  |
16 (3%) |
Sweden  |
16 (3%) |
Russian Federation  |
10 (2%) |
Canada  |
10 (2%) |
Japan  |
10 (2%) |
United Kingdom of Great Britain and Northern Ireland  |
7 (1%) |
Singapore  |
7 (1%) |
Hong Kong (China)  |
6 (1%) |
Ireland  |
5 (1%) |
Romania  |
5 (1%) |
Netherlands (Kingdom of the)  |
5 (1%) |
Ukraine  |
4 (1%) |
Italy  |
4 (1%) |
Denmark  |
4 (1%) |
Australia  |
3 (0%) |
Iran  |
3 (0%) |
Czechia  |
3 (0%) |
European Union location  |
2 (0%) |
Bulgaria  |
2 (0%) |
Finland  |
2 (0%) |
Pakistan  |
2 (0%) |
Iraq  |
2 (0%) |
Philippines  |
2 (0%) |
Moldova, The Republic of  |
1 (0%) |
Poland  |
1 (0%) |
Greece  |
1 (0%) |
Morocco  |
1 (0%) |
Thailand  |
1 (0%) |
Argentina  |
1 (0%) |
Indonesia  |
1 (0%) |
Unknown (Satellite Provider)  |
1 (0%) |
Asia-Pacific location  |
1 (0%) |
Israel  |
1 (0%) |
Belgium  |
1 (0%) |
Jordan  |
1 (0%) |
South Africa  |
1 (0%) |
Bangladesh  |
1 (0%) |
Armenia  |
1 (0%) |