Skip to main content
Record
Title
Test Planning for Core-based 3D Stacked ICs with Through-Silicon Vias
Type
Conference Proceeding/Paper
Publ. year
2012
Author/s
Sengupta, Breeta; Ingelsson, Urban; Larsson, Erik
Department/s
Department of Electrical and Information Technology; Digital ASIC-lup-obsolete
In LUP since
2016-04-04
Downloads

Total This Year This Month
608 5 1
Downloads per country

United States of America 252 (41%)
India 82 (13%)
China 49 (8%)
Germany 30 (5%)
Taiwan (China) 29 (5%)
South Korea 21 (3%)
Sweden 16 (3%)
France 16 (3%)
Japan 10 (2%)
Russian Federation 10 (2%)
Canada 10 (2%)
United Kingdom of Great Britain and Northern Ireland 7 (1%)
Singapore 7 (1%)
Hong Kong (China) 6 (1%)
Netherlands (Kingdom of the) 5 (1%)
Romania 5 (1%)
Ireland 5 (1%)
Ukraine 4 (1%)
Italy 4 (1%)
Denmark 4 (1%)
Czechia 3 (0%)
Iran 3 (0%)
Australia 3 (0%)
Finland 2 (0%)
Iraq 2 (0%)
Philippines 2 (0%)
European Union location 2 (0%)
Bulgaria 2 (0%)
Pakistan 2 (0%)
Greece 1 (0%)
Morocco 1 (0%)
Poland 1 (0%)
Jordan 1 (0%)
Bangladesh 1 (0%)
Armenia 1 (0%)
Belgium 1 (0%)
Unknown (Satellite Provider) 1 (0%)
Thailand 1 (0%)
Argentina 1 (0%)
Indonesia 1 (0%)
South Africa 1 (0%)
Israel 1 (0%)
Asia-Pacific location 1 (0%)
Moldova, The Republic of 1 (0%)
About
The download statistics shown here have been collected since the launch of LUP in October 2007 and are updated every night. Statistics are available for all records with open access fulltexts. Efforts have been made to exclude downloads by robots and track irregular download activities.

About accessibility

Disclaimer
The information on downloads per country is based on the geolocation of IP addresses and may not be completely accurate. The statistics presented here may also change retroactively when the calculation process is improved to provide more accurate results.

Statistics Last Updated
Fri Jul 26 08:38:05 2024