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Development of a new package solution for LTI-doughs

Segerberg, David (1999)
Packaging Logistics
Abstract
This report is written about a project with LTI-dough products. LTI stands for Low Temperature Inactive. The LTI-doughs are made with special yeast that stays inactive at low temperatures. All products made of LTI-dough in this project are pizzas.

There were two main reasons for this project. The present package and handling costs are too high compared with the product costs. The present package is also too small for the newly developed Pan-pizzas, especially for the Italian market with high distribution temperatures.

The objectives with this project were to analyse different package solutions and to determine the package sizes of the recommended solution. Two suggested package solutions existed at the beginning of the project: one with... (More)
This report is written about a project with LTI-dough products. LTI stands for Low Temperature Inactive. The LTI-doughs are made with special yeast that stays inactive at low temperatures. All products made of LTI-dough in this project are pizzas.

There were two main reasons for this project. The present package and handling costs are too high compared with the product costs. The present package is also too small for the newly developed Pan-pizzas, especially for the Italian market with high distribution temperatures.

The objectives with this project were to analyse different package solutions and to determine the package sizes of the recommended solution. Two suggested package solutions existed at the beginning of the project: one with shrink-wrapped consumer packages made out of corrugated board and another with a corrugated box as transport package and the consumer packages made of cardboard.

The results from a compression test showed that it was possible to make a third package solution with less material by combining the two first solutions.

The third alternative solution packages are made of:

the primary package ? flexible plastic

the consumer package ? cardboard carton

. the transport package ? shrink-wrap

the tertiary package ? stretch-wrapped Euro-pallet

The new solution was tested in a transport test together with the solution based on cardboard carton packages in boxes. The transport test showed that both solutions were suitable to use, but since the package solution 3 is the most cost efficient solution it is recommended.

The package sizes were determined based on a dough size test and retrospective calculation from the Euro-pallet. The pallet patterns were made with a pallet pattern calculation program. The primary package sizes still have to be decided but all other packages have their sizes fixed.

After the transport test an additional compression test was made to evaluate a new placement of the consumer packages and to see how much the simplifications in the transport test effected the compression strength.

There are still things to improve on solution 3 but the conclusion made, after all the tests, is that it will work.

The final recommendation is to continue the development of the package solution alternative 3 and to use the developed package sizes. (Less)
Please use this url to cite or link to this publication:
author
Segerberg, David
supervisor
organization
year
type
H2 - Master's Degree (Two Years)
subject
keywords
LTI-doughs, packaging development, low temperature inactive, Technological sciences, Teknik
language
English
id
1318630
date added to LUP
2008-06-03 00:00:00
date last changed
2010-02-01 14:40:03
@misc{1318630,
  abstract     = {This report is written about a project with LTI-dough products. LTI stands for Low Temperature Inactive. The LTI-doughs are made with special yeast that stays inactive at low temperatures. All products made of LTI-dough in this project are pizzas.

There were two main reasons for this project. The present package and handling costs are too high compared with the product costs. The present package is also too small for the newly developed Pan-pizzas, especially for the Italian market with high distribution temperatures.

The objectives with this project were to analyse different package solutions and to determine the package sizes of the recommended solution. Two suggested package solutions existed at the beginning of the project: one with shrink-wrapped consumer packages made out of corrugated board and another with a corrugated box as transport package and the consumer packages made of cardboard.

The results from a compression test showed that it was possible to make a third package solution with less material by combining the two first solutions.

The third alternative solution packages are made of:

the primary package ? flexible plastic

the consumer package ? cardboard carton

. the transport package ? shrink-wrap

the tertiary package ? stretch-wrapped Euro-pallet

The new solution was tested in a transport test together with the solution based on cardboard carton packages in boxes. The transport test showed that both solutions were suitable to use, but since the package solution 3 is the most cost efficient solution it is recommended.

The package sizes were determined based on a dough size test and retrospective calculation from the Euro-pallet. The pallet patterns were made with a pallet pattern calculation program. The primary package sizes still have to be decided but all other packages have their sizes fixed.

After the transport test an additional compression test was made to evaluate a new placement of the consumer packages and to see how much the simplifications in the transport test effected the compression strength.

There are still things to improve on solution 3 but the conclusion made, after all the tests, is that it will work.

The final recommendation is to continue the development of the package solution alternative 3 and to use the developed package sizes.},
  author       = {Segerberg, David},
  keyword      = {LTI-doughs,packaging development,low temperature inactive,Technological sciences,Teknik},
  language     = {eng},
  note         = {Student Paper},
  title        = {Development of a new package solution for LTI-doughs},
  year         = {1999},
}