Optimizing mechanics and the process of fixing sensor PCB card to optics after active alignment
(2015) MMK820 20151Innovation
- Abstract
- This report describes the development of a new fixing process when attaching a sensor PCB card to a camera assembly. The thesis focused on cameras which requires calibration to find the optimal position of the sensor PCB card, a process called active alignment.
The development process applied for this thesis was derived from the Generic Development Process by Ulrich and Eppinger. Interviewees with project members and experts within Axis Communications AB were the main source of information. From the interviewees’ statements, an interpretation into customer needs was performed. Some of the more important identified needs were to simplify production and minimize the sources of error present with the current solutions.
The challenges... (More) - This report describes the development of a new fixing process when attaching a sensor PCB card to a camera assembly. The thesis focused on cameras which requires calibration to find the optimal position of the sensor PCB card, a process called active alignment.
The development process applied for this thesis was derived from the Generic Development Process by Ulrich and Eppinger. Interviewees with project members and experts within Axis Communications AB were the main source of information. From the interviewees’ statements, an interpretation into customer needs was performed. Some of the more important identified needs were to simplify production and minimize the sources of error present with the current solutions.
The challenges with the process of fixing the sensor PCB card were broken down to a simpler version, i.e. fixing two arbitrary components. The customer needs were used to evaluate different fixing methods and the most promising methods were selected. A concept generation process was initiated to find possible solutions within each fixing method. The most basic concepts were quickly evaluated through discussion and then later on through a concept scoring, to identify the most promising ideas. Further evaluation of these concepts included more information gathering of the fixing methods and discussions about their implementation into production. Then, the most promising concept was selected.
With this concept, the details of the solution were further optimized. Through further testing, new demands of the concept were found and solved, arriving at the final specifications of the concept. The final design solution was validated through more thorough testing.
The result is a new general process, which uses UV light curable adhesives. By adding a transparent silicone gasket, control over the adhesive is obtained and results in a simplified as well as significantly improved production chain. (Less)
Please use this url to cite or link to this publication:
http://lup.lub.lu.se/student-papers/record/7766887
- author
- Wahlgren, Theodor LU and Nilsson, Erik
- supervisor
- organization
- course
- MMK820 20151
- year
- 2015
- type
- H2 - Master's Degree (Two Years)
- subject
- keywords
- Active alignment, Adhesive, UV light, Sensor PCB card, Camera, Product development, Axis Communications AB
- other publication id
- ISRN: LUTMDN/ TMKT--15/5527—SE
- language
- English
- id
- 7766887
- date added to LUP
- 2015-08-25 13:37:49
- date last changed
- 2015-10-07 14:54:21
@misc{7766887,
abstract = {{This report describes the development of a new fixing process when attaching a sensor PCB card to a camera assembly. The thesis focused on cameras which requires calibration to find the optimal position of the sensor PCB card, a process called active alignment.
The development process applied for this thesis was derived from the Generic Development Process by Ulrich and Eppinger. Interviewees with project members and experts within Axis Communications AB were the main source of information. From the interviewees’ statements, an interpretation into customer needs was performed. Some of the more important identified needs were to simplify production and minimize the sources of error present with the current solutions.
The challenges with the process of fixing the sensor PCB card were broken down to a simpler version, i.e. fixing two arbitrary components. The customer needs were used to evaluate different fixing methods and the most promising methods were selected. A concept generation process was initiated to find possible solutions within each fixing method. The most basic concepts were quickly evaluated through discussion and then later on through a concept scoring, to identify the most promising ideas. Further evaluation of these concepts included more information gathering of the fixing methods and discussions about their implementation into production. Then, the most promising concept was selected.
With this concept, the details of the solution were further optimized. Through further testing, new demands of the concept were found and solved, arriving at the final specifications of the concept. The final design solution was validated through more thorough testing.
The result is a new general process, which uses UV light curable adhesives. By adding a transparent silicone gasket, control over the adhesive is obtained and results in a simplified as well as significantly improved production chain.}},
author = {{Wahlgren, Theodor and Nilsson, Erik}},
language = {{eng}},
note = {{Student Paper}},
title = {{Optimizing mechanics and the process of fixing sensor PCB card to optics after active alignment}},
year = {{2015}},
}