System in Package (SiP) with Embedded Antenna
(2024) EITM02 20241Department of Electrical and Information Technology
- Abstract
- System in Package (SiP) is often used in wireless technologies where different active and passive components can be integrated under the same substrate, resulting in smaller devices and lower costs. The design of the embedded antennas in system in package is a challenge from various points of view. Since system in packages are often used when a small module is needed, and as the size of the module decreases, the size of the antenna embedded in the SiP should also become smaller, making it complicated to design an antenna with high performance.
The aim of the thesis is to design a very small antenna with a size of 3×10 mm, covering the frequency range from 5.15 to 7.125 GHz, with high performance in terms of return loss, radiation... (More) - System in Package (SiP) is often used in wireless technologies where different active and passive components can be integrated under the same substrate, resulting in smaller devices and lower costs. The design of the embedded antennas in system in package is a challenge from various points of view. Since system in packages are often used when a small module is needed, and as the size of the module decreases, the size of the antenna embedded in the SiP should also become smaller, making it complicated to design an antenna with high performance.
The aim of the thesis is to design a very small antenna with a size of 3×10 mm, covering the frequency range from 5.15 to 7.125 GHz, with high performance in terms of return loss, radiation efficiency, peak gain, radiation pattern and other important parameters. The antenna is designed on a 13.4×10.6 mm SiP module mounted on a 30×50 mm carrier board. The performance of the antenna is also investigated at different locations on the carrier board. It is worth mentioning that the components on the module are covered by a metal shield that can affect the performance of the antenna, which was taken into the account during the design. The work included literature studies, design and simulations of an antenna model with acceptable performance and measurements of antenna prototypes. Ansys HFSS, the high-frequency structure simulator, was used for the design and simulation. In the next step, the design was created in Cadence Allegro to be prepared for manufacturing. ROHDE & SCHWARZ ZNB 20 Vector Network Analyzer and the u-blox anechoic chamber were used for the prototype measurements. As a result of this thesis, two printed monopole antennas with a size of 3 ×10 mm were designed and simulated, both of which showed acceptable performance to cover the frequency bandwidth of 5 to 7 GHz in the simulation. The measurements of the prototype were also carried out for some parameters. The focus of this work was on the design of the antenna on a carrier board with FR-4 dielectric substrate and a thickness of 1.6 mm. The antennas were fabricated on a substrate with a total thickness of 0.8 mm (0.4 mm for the module and 0.4 mm for the carrier board) in order to keep the thickness of the module and the carrier board the same for cost reasons. It is worth noting that the behavior of the antennas at this specific thickness was also investigated in this degree project. (Less) - Popular Abstract
- Nowadays, compact and high performance devices play an important role in the world of wireless technologies. An important innovation in this area is System in Package (SiP), in which multiple silicon components (chips) are integrated into a single package together with other passive components such as capacitors, inductors, antennas, etc. SiP has a wide range of applications nowadays, it can be used in smartphones, wearables and Internet of Things (IoT) modules and is also used for devices such as power amplifier modules, Wi-Fi and Bluetooth modules.
On the other hand, antennas are the technology that plays a crucial role in today’s age of information explosion. Antennas are found in all kinds of wireless devices and can connect millions... (More) - Nowadays, compact and high performance devices play an important role in the world of wireless technologies. An important innovation in this area is System in Package (SiP), in which multiple silicon components (chips) are integrated into a single package together with other passive components such as capacitors, inductors, antennas, etc. SiP has a wide range of applications nowadays, it can be used in smartphones, wearables and Internet of Things (IoT) modules and is also used for devices such as power amplifier modules, Wi-Fi and Bluetooth modules.
On the other hand, antennas are the technology that plays a crucial role in today’s age of information explosion. Antennas are found in all kinds of wireless devices and can connect millions of users wirelessly every day. Antennas can also be embedded as passive components in SiP. The embedded antennas are usually placed at the edge of the module to receive and transmit the electromagnetic waves and are connected to an AC source inside the SiP module. When the antenna acts as a receiver, it converts the electromagnetic waves into an electrical signal and when it acts as a transmitter, it converts the electrical signal into electromagnetic waves. Since the components in the package are very close to each other to form a small module, the embedded antenna is exposed to the proximity of other components, which can affect the performance of the antenna. There are other factors that need to be considered when designing the antenna, such as the position of the antenna in the SiP module and its location in relation to the ground plane, as well as the way the module is placed on the carrier board can be mentioned as factors that can influence the performance of the antenna and should be considered by the designer.
The aim of this master thesis is to create a simulation model of a SiP with embedded antenna, focusing on performance and size. The main focus is on the Wi-Fi bands 5-7 GHz. The design is simulated to create a feasible antenna design and optimize the design to meet the specifications such as bandwidth, radiation characteristics, efficiency, peak gain, return loss, etc. At the end of the project, the design that fulfils the target data for the simulation model was achieved. It is worth mentioning that the final simulated antennas were manufactured and the measurement of the antenna prototypes was carried out to study the behavior of the antenna in the real world. As a final result of the project, two different antennas were achieved that were able to fulfill most of the simulation targets and also showed acceptable performance for some of the parameters measured in the prototype. (Less)
Please use this url to cite or link to this publication:
http://lup.lub.lu.se/student-papers/record/9154416
- author
- Baharipanbehchouleh, Hamed LU
- supervisor
- organization
- course
- EITM02 20241
- year
- 2024
- type
- H2 - Master's Degree (Two Years)
- subject
- report number
- LU/LTH-EIT 2024-972
- language
- English
- id
- 9154416
- date added to LUP
- 2024-05-30 14:13:21
- date last changed
- 2024-06-17 13:32:39
@misc{9154416,
abstract = {{System in Package (SiP) is often used in wireless technologies where different active and passive components can be integrated under the same substrate, resulting in smaller devices and lower costs. The design of the embedded antennas in system in package is a challenge from various points of view. Since system in packages are often used when a small module is needed, and as the size of the module decreases, the size of the antenna embedded in the SiP should also become smaller, making it complicated to design an antenna with high performance.
The aim of the thesis is to design a very small antenna with a size of 3×10 mm, covering the frequency range from 5.15 to 7.125 GHz, with high performance in terms of return loss, radiation efficiency, peak gain, radiation pattern and other important parameters. The antenna is designed on a 13.4×10.6 mm SiP module mounted on a 30×50 mm carrier board. The performance of the antenna is also investigated at different locations on the carrier board. It is worth mentioning that the components on the module are covered by a metal shield that can affect the performance of the antenna, which was taken into the account during the design. The work included literature studies, design and simulations of an antenna model with acceptable performance and measurements of antenna prototypes. Ansys HFSS, the high-frequency structure simulator, was used for the design and simulation. In the next step, the design was created in Cadence Allegro to be prepared for manufacturing. ROHDE & SCHWARZ ZNB 20 Vector Network Analyzer and the u-blox anechoic chamber were used for the prototype measurements. As a result of this thesis, two printed monopole antennas with a size of 3 ×10 mm were designed and simulated, both of which showed acceptable performance to cover the frequency bandwidth of 5 to 7 GHz in the simulation. The measurements of the prototype were also carried out for some parameters. The focus of this work was on the design of the antenna on a carrier board with FR-4 dielectric substrate and a thickness of 1.6 mm. The antennas were fabricated on a substrate with a total thickness of 0.8 mm (0.4 mm for the module and 0.4 mm for the carrier board) in order to keep the thickness of the module and the carrier board the same for cost reasons. It is worth noting that the behavior of the antennas at this specific thickness was also investigated in this degree project.}},
author = {{Baharipanbehchouleh, Hamed}},
language = {{eng}},
note = {{Student Paper}},
title = {{System in Package (SiP) with Embedded Antenna}},
year = {{2024}},
}