Surface Modification of MEMS Chips for Increased Thermal and Chemical Stability
(2026) KASM10 20252Centre for Analysis and Synthesis
- Abstract
- The introduction of the Environmental Transmission Electron Microscope (ETEM) has revolutionized scientific studies by allowing in-situ studies of nano and angstrom scale samples in varying environments. In combination with the introduction of the
Microelectromechanical Systems (MEMS) chip the ETEM has become a powerful tool for high resolution imaging of material interaction. However, the MEMS chips use a thin silicon nitride film which reacts with certain metals to form silicides. The unwanted reaction results in a limitation when observing metal reactions in the ETEM.
In this report, a thin film will be applied to the MEMS chip by using Atomic Layer Deposition (ALD) in order to prevent the formation of silicides by creating a barrier... (More) - The introduction of the Environmental Transmission Electron Microscope (ETEM) has revolutionized scientific studies by allowing in-situ studies of nano and angstrom scale samples in varying environments. In combination with the introduction of the
Microelectromechanical Systems (MEMS) chip the ETEM has become a powerful tool for high resolution imaging of material interaction. However, the MEMS chips use a thin silicon nitride film which reacts with certain metals to form silicides. The unwanted reaction results in a limitation when observing metal reactions in the ETEM.
In this report, a thin film will be applied to the MEMS chip by using Atomic Layer Deposition (ALD) in order to prevent the formation of silicides by creating a barrier between the metal particles and silicon nitride film. For this purpose SiO2,
Al2O3 and ZrO2 go through thorough testing inside the ETEM evaluating reactivity, structural integrity and effect on temperature output of the MEMS chip. The results point to a possible solution where Al2O3 showed the most promising results.
In comparison, ZrO2 lacked structural uniformity and SiO2 was heavily damaged by the electron beam. Additionally, no major difference on MEMS chip operation temperature was found. (Less) - Popular Abstract
- Environmental Transmission Electron Microscopes (ETEM) in combination with Microelectromechanical Systems (MEMS) is like the Swiss army knife of electron microscopes. But there are also limits to what you can cut. When studying metal particles in extreme conditions they tend to react with the MEMS chip which results in them breaking. In this thesis the MEMS chips were modified with a thin protective layer to prevent these reactions and the results show an improvement compared to a normal chip.
Please use this url to cite or link to this publication:
http://lup.lub.lu.se/student-papers/record/9223463
- author
- Nilsson, Johan LU
- supervisor
-
- Martin Ek LU
- organization
- alternative title
- Ytbehandlig av MEMS Chip för Ökad Termisk och Kemisk Stabilitet
- course
- KASM10 20252
- year
- 2026
- type
- H2 - Master's Degree (Two Years)
- subject
- keywords
- MEMS, Micromechanical systems chip, Electron microscope, Transmission electron microscope, Environmental transmission electron microscope, ETEM, TEM, X-ray dispersive spectra, XEDS, EDS, Atomic layer deposition, ALD, extreme, temperature, strobe peak, thin film, silica, alumina, zirconia, silicon nitride, nickle, phosphine, reduction, imaging, nanotechnology, nano, material chemistry
- language
- English
- id
- 9223463
- date added to LUP
- 2026-03-04 09:59:44
- date last changed
- 2026-03-04 09:59:44
@misc{9223463,
abstract = {{The introduction of the Environmental Transmission Electron Microscope (ETEM) has revolutionized scientific studies by allowing in-situ studies of nano and angstrom scale samples in varying environments. In combination with the introduction of the
Microelectromechanical Systems (MEMS) chip the ETEM has become a powerful tool for high resolution imaging of material interaction. However, the MEMS chips use a thin silicon nitride film which reacts with certain metals to form silicides. The unwanted reaction results in a limitation when observing metal reactions in the ETEM.
In this report, a thin film will be applied to the MEMS chip by using Atomic Layer Deposition (ALD) in order to prevent the formation of silicides by creating a barrier between the metal particles and silicon nitride film. For this purpose SiO2,
Al2O3 and ZrO2 go through thorough testing inside the ETEM evaluating reactivity, structural integrity and effect on temperature output of the MEMS chip. The results point to a possible solution where Al2O3 showed the most promising results.
In comparison, ZrO2 lacked structural uniformity and SiO2 was heavily damaged by the electron beam. Additionally, no major difference on MEMS chip operation temperature was found.}},
author = {{Nilsson, Johan}},
language = {{eng}},
note = {{Student Paper}},
title = {{Surface Modification of MEMS Chips for Increased Thermal and Chemical Stability}},
year = {{2026}},
}