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Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules

Vinay, N.S.; Larsson, Erik LU and Singh, Virendra (2009) DATE 2009 Friday Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Tes
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Contribution to conference
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conference name
<em>DATE 2009 Friday Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Tes</em>
language
English
LU publication?
no
id
4f60d110-0df3-4388-9958-8734a2fa7005 (old id 2340892)
date added to LUP
2012-02-10 13:49:35
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2016-10-11 08:35:14
@misc{4f60d110-0df3-4388-9958-8734a2fa7005,
  author       = {Vinay, N.S. and Larsson, Erik and Singh, Virendra},
  language     = {eng},
  title        = {Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules},
  year         = {2009},
}