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Tensile behavior of single-crystal nano-sized copper beams with voids

Melin, Solveig LU ; Ahadi, Aylin LU and Hansson, Per LU (2017) 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE In Solid State Phenomena 258 SSP. p.53-56
Abstract

The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two... (More)

The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.

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Please use this url to cite or link to this publication:
author
; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
MD simulations, Single crystal Cu, Tensile Strength, Void size effects, Voids in nano-beams
host publication
Materials Structure and Micromechanics of Fracture VIII
series title
Solid State Phenomena
volume
258 SSP
pages
4 pages
publisher
Trans Tech Publications
conference name
8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
conference location
Brno, Czech Republic
conference dates
2016-06-27 - 2016-06-29
external identifiers
  • scopus:85009781750
ISSN
16629779
ISBN
9783038356264
DOI
10.4028/www.scientific.net/SSP.258.53
project
Modelling mechanical properties at nanoscale by molecular dynamics
language
English
LU publication?
yes
id
01b3dec5-1fc4-409e-b369-38c2d08a103b
date added to LUP
2017-03-16 11:00:00
date last changed
2025-04-04 15:00:28
@inproceedings{01b3dec5-1fc4-409e-b369-38c2d08a103b,
  abstract     = {{<p>The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.</p>}},
  author       = {{Melin, Solveig and Ahadi, Aylin and Hansson, Per}},
  booktitle    = {{Materials Structure and Micromechanics of Fracture VIII}},
  isbn         = {{9783038356264}},
  issn         = {{16629779}},
  keywords     = {{MD simulations; Single crystal Cu; Tensile Strength; Void size effects; Voids in nano-beams}},
  language     = {{eng}},
  pages        = {{53--56}},
  publisher    = {{Trans Tech Publications}},
  series       = {{Solid State Phenomena}},
  title        = {{Tensile behavior of single-crystal nano-sized copper beams with voids}},
  url          = {{http://dx.doi.org/10.4028/www.scientific.net/SSP.258.53}},
  doi          = {{10.4028/www.scientific.net/SSP.258.53}},
  volume       = {{258 SSP}},
  year         = {{2017}},
}