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Comparative Study of the Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks

Xie, Gongnan ; Chen, Zhiyong ; Sundén, Bengt LU and Zhang, Weihong (2013) In Numerical Heat Transfer Part A: Applications 64(1). p.30-55
Abstract
Applications of microchannel heat sinks for dissipating heat loads have received great attention. Wavy channels are recognized to be an alternative cooling technology to enhance the heat transfer, and are successfully applied in heat exchangers. In this article, three kinds of liquid-cooling double-layer microchannel heat sinks, such as a rectangular straight microchannel heat sink, a parallel-flow wavy microchannel heat sink, and a counter-flow double-layer wavy microchannel heat sink, have been designed and the corresponding laminar flow and heat transfer have been investigated numerically. The effects of the wave amplitude and volumetric flow ratio on heat transfer, pressure drop, and thermal resistance are also observed. Results show... (More)
Applications of microchannel heat sinks for dissipating heat loads have received great attention. Wavy channels are recognized to be an alternative cooling technology to enhance the heat transfer, and are successfully applied in heat exchangers. In this article, three kinds of liquid-cooling double-layer microchannel heat sinks, such as a rectangular straight microchannel heat sink, a parallel-flow wavy microchannel heat sink, and a counter-flow double-layer wavy microchannel heat sink, have been designed and the corresponding laminar flow and heat transfer have been investigated numerically. The effects of the wave amplitude and volumetric flow ratio on heat transfer, pressure drop, and thermal resistance are also observed. Results show that the counter-flow double-layer wavy microchannel heat sink is superior at a larger flow rate, and a more uniform temperature rise is achieved. For a slightly larger flow rate, the parallel flow layout shows better performance. In addition to the overall thermal resistance, other criteria for evaluation of the overall thermal performance, e.g., (Nu/Nu(0))/(f/f(0)) and (Nu/Nu(0))/(f/f(0))(1/3), are applied and similar results are obtained. (Less)
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author
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organization
publishing date
type
Contribution to journal
publication status
published
subject
in
Numerical Heat Transfer Part A: Applications
volume
64
issue
1
pages
30 - 55
publisher
Taylor & Francis
external identifiers
  • wos:000318153600002
  • scopus:84877656020
ISSN
1040-7782
DOI
10.1080/10407782.2013.773811
language
English
LU publication?
yes
id
22a5d46a-a053-446f-8fd5-fe672f9acdc3 (old id 3843121)
date added to LUP
2016-04-01 14:04:53
date last changed
2022-03-21 22:05:41
@article{22a5d46a-a053-446f-8fd5-fe672f9acdc3,
  abstract     = {{Applications of microchannel heat sinks for dissipating heat loads have received great attention. Wavy channels are recognized to be an alternative cooling technology to enhance the heat transfer, and are successfully applied in heat exchangers. In this article, three kinds of liquid-cooling double-layer microchannel heat sinks, such as a rectangular straight microchannel heat sink, a parallel-flow wavy microchannel heat sink, and a counter-flow double-layer wavy microchannel heat sink, have been designed and the corresponding laminar flow and heat transfer have been investigated numerically. The effects of the wave amplitude and volumetric flow ratio on heat transfer, pressure drop, and thermal resistance are also observed. Results show that the counter-flow double-layer wavy microchannel heat sink is superior at a larger flow rate, and a more uniform temperature rise is achieved. For a slightly larger flow rate, the parallel flow layout shows better performance. In addition to the overall thermal resistance, other criteria for evaluation of the overall thermal performance, e.g., (Nu/Nu(0))/(f/f(0)) and (Nu/Nu(0))/(f/f(0))(1/3), are applied and similar results are obtained.}},
  author       = {{Xie, Gongnan and Chen, Zhiyong and Sundén, Bengt and Zhang, Weihong}},
  issn         = {{1040-7782}},
  language     = {{eng}},
  number       = {{1}},
  pages        = {{30--55}},
  publisher    = {{Taylor & Francis}},
  series       = {{Numerical Heat Transfer Part A: Applications}},
  title        = {{Comparative Study of the Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks}},
  url          = {{http://dx.doi.org/10.1080/10407782.2013.773811}},
  doi          = {{10.1080/10407782.2013.773811}},
  volume       = {{64}},
  year         = {{2013}},
}