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Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Xie, Gongnan; Liu, Jian; Zhang, Weihong and Sundén, Bengt LU (2012) In Journal of Electronic Packaging 134(4).
Abstract
With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy... (More)
With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. [DOI: 10.1115/1.4023035] (Less)
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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
transversal wavy microchannel, pressure drop, overall thermal, resistance, numerical simulation
in
Journal of Electronic Packaging
volume
134
issue
4
publisher
American Society Of Mechanical Engineers (ASME)
external identifiers
  • wos:000313031000010
  • scopus:84872035698
ISSN
1043-7398
DOI
10.1115/1.4023035
language
English
LU publication?
yes
id
c28b1b74-a205-4df0-a95c-a859e55e00c4 (old id 3508095)
date added to LUP
2013-02-21 12:16:38
date last changed
2017-09-10 03:09:28
@article{c28b1b74-a205-4df0-a95c-a859e55e00c4,
  abstract     = {With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. [DOI: 10.1115/1.4023035]},
  articleno    = {041010},
  author       = {Xie, Gongnan and Liu, Jian and Zhang, Weihong and Sundén, Bengt},
  issn         = {1043-7398},
  keyword      = {transversal wavy microchannel,pressure drop,overall thermal,resistance,numerical simulation},
  language     = {eng},
  number       = {4},
  publisher    = {American Society Of Mechanical Engineers (ASME)},
  series       = {Journal of Electronic Packaging},
  title        = {Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling},
  url          = {http://dx.doi.org/10.1115/1.4023035},
  volume       = {134},
  year         = {2012},
}