Advanced

Microstructure evolution during dynamic discontinuous recrystallization in particle-containing Cu

Hallberg, Håkan LU ; Svendsen, Bob; Kayser, Tobias and Ristinmaa, Matti LU (2014) In Computational Materials Science 84. p.327-338
Abstract
Control of the grain size in a material is vital in many engineering applications. Evolving through recrystallization, the grain size is strongly influenced by the presence of impurity particles. These

particles exert drag forces on migrating grain boundaries and prevent grain boundary motion by pinning of the boundaries. Taking copper as example material, the present work establishes a novel simulation model where dynamic discontinuous recrystallization is influenced by particle drag. The recrystallization kinetics are established on a microlevel and the simulations are performed using a 3D cellular automaton algorithm with probabilistic cell state switches. By this approach, computational efficiency is combined with high... (More)
Control of the grain size in a material is vital in many engineering applications. Evolving through recrystallization, the grain size is strongly influenced by the presence of impurity particles. These

particles exert drag forces on migrating grain boundaries and prevent grain boundary motion by pinning of the boundaries. Taking copper as example material, the present work establishes a novel simulation model where dynamic discontinuous recrystallization is influenced by particle drag. The recrystallization kinetics are established on a microlevel and the simulations are performed using a 3D cellular automaton algorithm with probabilistic cell state switches. By this approach, computational efficiency is combined with high temporal and spatial resolution of the microstructure evolution. The simulate

d microstructure changes are in good agreement with experimental findings and the recrystallization kinetics are shown to comply with classical Kolmogorov/Johnson/Mehl/Avrami (KJMA) theory. In addition, through homogenization, the macroscopic flow stress behavior is studied and is also shown to exhibit the expected transition

from single-peak stable flow into serrated multiple-peak flow as the processing temperature is increased. Influence of changed initial grain sizes is studied and, in compliance with experimental data, an increased initial grain size stabilizes the flow stress behavior whereas the opposite trend is found for reduced initial grain sizes. Introducing impurity particles in the simulations, the progression of recrystallization is retarded and optimum values of the particle dispersion level are identified at different temperatures, allowing minimization of the recrystallized grain size during thermomechanical processing of the material. (Less)
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
in
Computational Materials Science
volume
84
pages
327 - 338
publisher
Elsevier
external identifiers
  • wos:000331086500040
  • scopus:84892173037
ISSN
0927-0256
DOI
10.1016/j.commatsci.2013.12.021
language
English
LU publication?
yes
id
639ef293-a5a3-4911-9c2f-e16f93ca454f (old id 4237983)
alternative location
http://www.hhallberg.com/papers/Hallberg2014_cms.pdf
date added to LUP
2014-01-13 10:29:01
date last changed
2017-09-17 06:53:44
@article{639ef293-a5a3-4911-9c2f-e16f93ca454f,
  abstract     = {Control of the grain size in a material is vital in many engineering applications. Evolving through recrystallization, the grain size is strongly influenced by the presence of impurity particles. These<br/><br>
particles exert drag forces on migrating grain boundaries and prevent grain boundary motion by pinning of the boundaries. Taking copper as example material, the present work establishes a novel simulation model where dynamic discontinuous recrystallization is influenced by particle drag. The recrystallization kinetics are established on a microlevel and the simulations are performed using a 3D cellular automaton algorithm with probabilistic cell state switches. By this approach, computational efficiency is combined with high temporal and spatial resolution of the microstructure evolution. The simulate<br/><br>
d microstructure changes are in good agreement with experimental findings and the recrystallization kinetics are shown to comply with classical Kolmogorov/Johnson/Mehl/Avrami (KJMA) theory. In addition, through homogenization, the macroscopic flow stress behavior is studied and is also shown to exhibit the expected transition<br/><br>
from single-peak stable flow into serrated multiple-peak flow as the processing temperature is increased. Influence of changed initial grain sizes is studied and, in compliance with experimental data, an increased initial grain size stabilizes the flow stress behavior whereas the opposite trend is found for reduced initial grain sizes. Introducing impurity particles in the simulations, the progression of recrystallization is retarded and optimum values of the particle dispersion level are identified at different temperatures, allowing minimization of the recrystallized grain size during thermomechanical processing of the material.},
  author       = {Hallberg, Håkan and Svendsen, Bob and Kayser, Tobias and Ristinmaa, Matti},
  issn         = {0927-0256},
  language     = {eng},
  pages        = {327--338},
  publisher    = {Elsevier},
  series       = {Computational Materials Science},
  title        = {Microstructure evolution during dynamic discontinuous recrystallization in particle-containing Cu},
  url          = {http://dx.doi.org/10.1016/j.commatsci.2013.12.021},
  volume       = {84},
  year         = {2014},
}