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Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Sundén, Bengt LU and Xie, Gongnan (2014) In Journal of Electronic Packaging 136(2).
Abstract
This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some... (More)
This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided. (Less)
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
thermal resistance network, electronic chips, air-cooling, offset strip, fin, local temperature
in
Journal of Electronic Packaging
volume
136
issue
2
publisher
American Society Of Mechanical Engineers (ASME)
external identifiers
  • wos:000335922400012
  • scopus:84899759607
ISSN
1043-7398
DOI
10.1115/1.4026538
language
English
LU publication?
yes
id
e5961eaa-4079-4a78-8d84-3b3cca2f4ad1 (old id 4469895)
date added to LUP
2014-06-19 09:25:25
date last changed
2017-01-01 03:07:47
@article{e5961eaa-4079-4a78-8d84-3b3cca2f4ad1,
  abstract     = {This short communication addresses a numerical investigation of the thermal behavior of an electronic unit. The unit consists of several parallel planes and on the top and bottom planes heat is generated by a number of electronic chips. The heat is transported by conduction through plastic and copper-invar layers. Finally, the heat is rejected by a forced air stream in the center of the unit. The channel system for the cooling air is designed as an offset strip fin surface. A three-dimensional numerical method based on a thermal resistance or conductance network has been developed. The grid points on the cooling air side are staggered compared to the grid points in the solid materials. Details of the numerical method as well as some temperature distributions on the chip planes are provided.},
  articleno    = {024501},
  author       = {Sundén, Bengt and Xie, Gongnan},
  issn         = {1043-7398},
  keyword      = {thermal resistance network,electronic chips,air-cooling,offset strip,fin,local temperature},
  language     = {eng},
  number       = {2},
  publisher    = {American Society Of Mechanical Engineers (ASME)},
  series       = {Journal of Electronic Packaging},
  title        = {Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink},
  url          = {http://dx.doi.org/10.1115/1.4026538},
  volume       = {136},
  year         = {2014},
}