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In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate

Li, Jiujuan LU ; Zhou, Guoyun ; Hong, Yan ; He, Wei ; Wang, Shouxu ; Wang, Chong ; Chen, Yuanming ; Zhou, Jinqun ; Miao, Hua and Weng, Zesheng , et al. (2020) In Electrochimica Acta 330.
Abstract

Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single... (More)

Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.

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organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Composite, Cu, Electroplating, Polythiophenes, Textile fabrics
in
Electrochimica Acta
volume
330
article number
135358
publisher
Pergamon Press Ltd.
external identifiers
  • scopus:85075892473
ISSN
0013-4686
DOI
10.1016/j.electacta.2019.135358
language
English
LU publication?
yes
id
45fa61f3-bcf1-4bee-9b31-3f60ec76858b
date added to LUP
2021-01-13 13:57:06
date last changed
2022-04-26 23:29:43
@article{45fa61f3-bcf1-4bee-9b31-3f60ec76858b,
  abstract     = {{<p>Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.</p>}},
  author       = {{Li, Jiujuan and Zhou, Guoyun and Hong, Yan and He, Wei and Wang, Shouxu and Wang, Chong and Chen, Yuanming and Zhou, Jinqun and Miao, Hua and Weng, Zesheng and Andersson, Martin}},
  issn         = {{0013-4686}},
  keywords     = {{Composite; Cu; Electroplating; Polythiophenes; Textile fabrics}},
  language     = {{eng}},
  publisher    = {{Pergamon Press Ltd.}},
  series       = {{Electrochimica Acta}},
  title        = {{In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate}},
  url          = {{http://dx.doi.org/10.1016/j.electacta.2019.135358}},
  doi          = {{10.1016/j.electacta.2019.135358}},
  volume       = {{330}},
  year         = {{2020}},
}