In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate
(2020) In Electrochimica Acta 330.- Abstract
Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single... (More)
Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.
(Less)
- author
- organization
- publishing date
- 2020
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Composite, Cu, Electroplating, Polythiophenes, Textile fabrics
- in
- Electrochimica Acta
- volume
- 330
- article number
- 135358
- publisher
- Pergamon Press Ltd.
- external identifiers
-
- scopus:85075892473
- ISSN
- 0013-4686
- DOI
- 10.1016/j.electacta.2019.135358
- language
- English
- LU publication?
- yes
- id
- 45fa61f3-bcf1-4bee-9b31-3f60ec76858b
- date added to LUP
- 2021-01-13 13:57:06
- date last changed
- 2022-04-26 23:29:43
@article{45fa61f3-bcf1-4bee-9b31-3f60ec76858b, abstract = {{<p>Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.</p>}}, author = {{Li, Jiujuan and Zhou, Guoyun and Hong, Yan and He, Wei and Wang, Shouxu and Wang, Chong and Chen, Yuanming and Zhou, Jinqun and Miao, Hua and Weng, Zesheng and Andersson, Martin}}, issn = {{0013-4686}}, keywords = {{Composite; Cu; Electroplating; Polythiophenes; Textile fabrics}}, language = {{eng}}, publisher = {{Pergamon Press Ltd.}}, series = {{Electrochimica Acta}}, title = {{In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate}}, url = {{http://dx.doi.org/10.1016/j.electacta.2019.135358}}, doi = {{10.1016/j.electacta.2019.135358}}, volume = {{330}}, year = {{2020}}, }