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Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

Xie, Gongnan; Li, Shian; Sundén, Bengt LU and Zhang, Weihong (2014) In International Journal of Numerical Methods for Heat & Fluid Flow 24(4). p.797-810
Abstract
Purpose - With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm x 35mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach - Computational fluid dynamics (CFD) technique is used to... (More)
Purpose - With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm x 35mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach - Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings - The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications - The fluid is incompressible and the thermophysical properties are constant. Practical implications - New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value - In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink. (Less)
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Minichannel, Chip Arrangement, Heat Sink, Thermal Performance
in
International Journal of Numerical Methods for Heat & Fluid Flow
volume
24
issue
4
pages
797 - 810
publisher
Emerald Group Publishing Limited
external identifiers
  • wos:000341757200003
  • scopus:84899856442
ISSN
1758-6585
DOI
10.1108/HFF-01-2013-0013
language
English
LU publication?
yes
id
78868bc0-f39c-498b-b3d9-0b8f8d13def7 (old id 4717100)
date added to LUP
2014-10-31 11:15:10
date last changed
2017-06-11 03:11:22
@article{78868bc0-f39c-498b-b3d9-0b8f8d13def7,
  abstract     = {Purpose - With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm x 35mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach - Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings - The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications - The fluid is incompressible and the thermophysical properties are constant. Practical implications - New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value - In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.},
  author       = {Xie, Gongnan and Li, Shian and Sundén, Bengt and Zhang, Weihong},
  issn         = {1758-6585},
  keyword      = {Minichannel,Chip Arrangement,Heat Sink,Thermal Performance},
  language     = {eng},
  number       = {4},
  pages        = {797--810},
  publisher    = {Emerald Group Publishing Limited},
  series       = {International Journal of Numerical Methods for Heat & Fluid Flow},
  title        = {Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements},
  url          = {http://dx.doi.org/10.1108/HFF-01-2013-0013},
  volume       = {24},
  year         = {2014},
}