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Laminar thermal performance of microchannel heat sinks with constructal vertical Y-shaped bifurcation plates

Li, Yanlong; Zhang, Fengli; Sundén, Bengt LU and Xie, Gongnan (2014) In Applied Thermal Engineering 73(1). p.185-195
Abstract
With increasing output power of integrated chips, the involved heat flux is accordingly increased. Traditional cooling methods failed to satisfy such a situation, and thus new cooling methods incorporating microchannel heat sinks with high capabilities of heat removal are necessary. In this paper, on the basis of a water-cooled smooth microchannel heat sink, vertical Y-shaped bifurcation plates are designed into the heat sink, and then the corresponding laminar flow and heat transfer are investigated numerically. Four different configurations of Y-shaped plates are considered by adjusting the angle between the two arms of the Y profile. The effects of the angle on heat transfer, pressure drop, and the thermal resistance are also observed... (More)
With increasing output power of integrated chips, the involved heat flux is accordingly increased. Traditional cooling methods failed to satisfy such a situation, and thus new cooling methods incorporating microchannel heat sinks with high capabilities of heat removal are necessary. In this paper, on the basis of a water-cooled smooth microchannel heat sink, vertical Y-shaped bifurcation plates are designed into the heat sink, and then the corresponding laminar flow and heat transfer are investigated numerically. Four different configurations of Y-shaped plates are considered by adjusting the angle between the two arms of the Y profile. The effects of the angle on heat transfer, pressure drop, and the thermal resistance are also observed and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall resistances subjected to inlet Reynolds number and pumping power are also compared for the five microchannel heat sinks. The results show that the thermal performance of the microchannel heat sinks with Y-shaped bifurcation plates is much better than that of the corresponding straight channel. It is suggested that the Y-shaped bifurcation plates placed in water-cooled microchannel heat sinks could improve the overall thermal performance when the angle between the two arms of the Y-shaped plates is designed properly. (C) 2014 Elsevier Ltd. All rights reserved. (Less)
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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Microchannel heat sink, Y-shaped plates, Bifurcation flow, Laminar heat, transfer, CFD
in
Applied Thermal Engineering
volume
73
issue
1
pages
185 - 195
publisher
Elsevier
external identifiers
  • wos:000346543400019
  • scopus:84905818424
ISSN
1359-4311
DOI
10.1016/j.applthermaleng.2014.07.031
language
English
LU publication?
yes
id
55adc487-a2c0-4dc1-a7c8-e06c771da38b (old id 4944592)
date added to LUP
2015-01-28 11:44:24
date last changed
2017-09-03 03:27:05
@article{55adc487-a2c0-4dc1-a7c8-e06c771da38b,
  abstract     = {With increasing output power of integrated chips, the involved heat flux is accordingly increased. Traditional cooling methods failed to satisfy such a situation, and thus new cooling methods incorporating microchannel heat sinks with high capabilities of heat removal are necessary. In this paper, on the basis of a water-cooled smooth microchannel heat sink, vertical Y-shaped bifurcation plates are designed into the heat sink, and then the corresponding laminar flow and heat transfer are investigated numerically. Four different configurations of Y-shaped plates are considered by adjusting the angle between the two arms of the Y profile. The effects of the angle on heat transfer, pressure drop, and the thermal resistance are also observed and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall resistances subjected to inlet Reynolds number and pumping power are also compared for the five microchannel heat sinks. The results show that the thermal performance of the microchannel heat sinks with Y-shaped bifurcation plates is much better than that of the corresponding straight channel. It is suggested that the Y-shaped bifurcation plates placed in water-cooled microchannel heat sinks could improve the overall thermal performance when the angle between the two arms of the Y-shaped plates is designed properly. (C) 2014 Elsevier Ltd. All rights reserved.},
  author       = {Li, Yanlong and Zhang, Fengli and Sundén, Bengt and Xie, Gongnan},
  issn         = {1359-4311},
  keyword      = {Microchannel heat sink,Y-shaped plates,Bifurcation flow,Laminar heat,transfer,CFD},
  language     = {eng},
  number       = {1},
  pages        = {185--195},
  publisher    = {Elsevier},
  series       = {Applied Thermal Engineering},
  title        = {Laminar thermal performance of microchannel heat sinks with constructal vertical Y-shaped bifurcation plates},
  url          = {http://dx.doi.org/10.1016/j.applthermaleng.2014.07.031},
  volume       = {73},
  year         = {2014},
}