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A Bond Wire Connection Implementation at mm-Wave Active Microstrip Antenna

Bondarik, Alexander LU ; Forsberg, Therese LU ; Sjöberg, Daniel LU ; Sjöland, Henrik LU and Tormänen, Markus LU (2019) In IEEE Microwave and Wireless Components Letters 29(6). p.427-429
Abstract

A bond wire to microstrip line transition, featuring two impedance transformers, is presented for a mm-wave microstrip antenna and power amplifier (PA) integration using conventional bond wires. Simulated return loss bandwidth for the transition is 4 GHz with a minimum insertion loss of 1 dB. Measurement results for the designed active antenna are compared with measurements for a passive antenna and a standalone PA. The maximum gain is 29 dBi, compared with 16.7-dBi passive antenna maximum gain. The half-power gain bandwidth is 7%. The measured active antenna radiation pattern is in good agreement with simulations. The maximum deembedded PA output power is close to 9 dBm.

Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Antenna arrays, complementary metal-oxide-semiconductor (CMOS) ICs, interconnect and package modeling, millimeter-wave integrated circuits
in
IEEE Microwave and Wireless Components Letters
volume
29
issue
6
pages
3 pages
publisher
IEEE--Institute of Electrical and Electronics Engineers Inc.
external identifiers
  • scopus:85067121326
ISSN
1531-1309
DOI
10.1109/LMWC.2019.2909855
language
English
LU publication?
yes
id
56892c46-b96b-4f44-8563-12be5bad68d9
date added to LUP
2019-07-01 08:37:59
date last changed
2019-07-16 04:13:33
@article{56892c46-b96b-4f44-8563-12be5bad68d9,
  abstract     = {<p>A bond wire to microstrip line transition, featuring two impedance transformers, is presented for a mm-wave microstrip antenna and power amplifier (PA) integration using conventional bond wires. Simulated return loss bandwidth for the transition is 4 GHz with a minimum insertion loss of 1 dB. Measurement results for the designed active antenna are compared with measurements for a passive antenna and a standalone PA. The maximum gain is 29 dBi, compared with 16.7-dBi passive antenna maximum gain. The half-power gain bandwidth is 7%. The measured active antenna radiation pattern is in good agreement with simulations. The maximum deembedded PA output power is close to 9 dBm.</p>},
  articleno    = {8703111},
  author       = {Bondarik, Alexander and Forsberg, Therese and Sjöberg, Daniel and Sjöland, Henrik and Tormänen, Markus},
  issn         = {1531-1309},
  keyword      = {Antenna arrays,complementary metal-oxide-semiconductor (CMOS) ICs,interconnect and package modeling,millimeter-wave integrated circuits},
  language     = {eng},
  number       = {6},
  pages        = {427--429},
  publisher    = {IEEE--Institute of Electrical and Electronics Engineers Inc.},
  series       = {IEEE Microwave and Wireless Components Letters},
  title        = {A Bond Wire Connection Implementation at mm-Wave Active Microstrip Antenna},
  url          = {http://dx.doi.org/10.1109/LMWC.2019.2909855},
  volume       = {29},
  year         = {2019},
}