The ABC130 barrel module prototyping programme for the ATLAS strip tracker
(2020) In Journal of Instrumentation 15(9).- Abstract
- For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these... (More)
- For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: An early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests. © 2020 CERN for the benefit of the ATLAS collaboration.. (Less)
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- author
- Poley, L ; Mullier, Geoffrey André Adrien LU ; Gillberg, Dag LU ; Herde, Hannah LU and Zhu, H.
- author collaboration
- organization
- publishing date
- 2020
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Detector design and construction technologies and materials, Front-end electronics for detector readout, Radiation-hard detectors, Si microstrip and pad detectors, Pixels, Readout systems, Silicon detectors, Silicon sensors, ATLAS detectors, Fabrication process, Inner Detector, Production sites, Readout chips, Second generation, Silicon tracker, Transition radiation, Software testing
- in
- Journal of Instrumentation
- volume
- 15
- issue
- 9
- article number
- P09004
- publisher
- IOP Publishing
- external identifiers
-
- scopus:85092411989
- ISSN
- 1748-0221
- DOI
- 10.1088/1748-0221/15/09/P09004
- language
- English
- LU publication?
- yes
- id
- 5dbe0250-6cf9-4531-9ef0-5af284590dbd
- date added to LUP
- 2020-11-03 13:02:32
- date last changed
- 2023-04-10 22:39:16
@article{5dbe0250-6cf9-4531-9ef0-5af284590dbd, abstract = {{For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: An early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests. © 2020 CERN for the benefit of the ATLAS collaboration..}}, author = {{Poley, L and Mullier, Geoffrey André Adrien and Gillberg, Dag and Herde, Hannah and Zhu, H.}}, issn = {{1748-0221}}, keywords = {{Detector design and construction technologies and materials; Front-end electronics for detector readout; Radiation-hard detectors; Si microstrip and pad detectors; Pixels; Readout systems; Silicon detectors; Silicon sensors; ATLAS detectors; Fabrication process; Inner Detector; Production sites; Readout chips; Second generation; Silicon tracker; Transition radiation; Software testing}}, language = {{eng}}, number = {{9}}, publisher = {{IOP Publishing}}, series = {{Journal of Instrumentation}}, title = {{The ABC130 barrel module prototyping programme for the ATLAS strip tracker}}, url = {{http://dx.doi.org/10.1088/1748-0221/15/09/P09004}}, doi = {{10.1088/1748-0221/15/09/P09004}}, volume = {{15}}, year = {{2020}}, }