Relationship between bonding strength and surface roughness in low-temperature bonding of glass for micro/nanofluidic device
(2024) In Journal of Micromechanics and Microengineering 34(1).- Abstract
The bonding of glass substrates is an important process in the fabrication of glass micro/nanofluidic devices. In this study, the influence of the surface roughness of glass substrates after low-temperature bonding is investigated. It is found that plasma etching can be used to control the surface roughness to the range 2-9 nm. Substrates with a roughness of 5 nm or less can be bonded. The pressure capacity of devices tends to decrease with increasing surface roughness. A pressure capacity of 500 kPa or higher is obtained with a surface roughness of 2 nm or less. This criterion for bonding conditions can be applied to roughness formed by other methods (e.g. via a Cr layer). The proposed approach will facilitate the design and... (More)
The bonding of glass substrates is an important process in the fabrication of glass micro/nanofluidic devices. In this study, the influence of the surface roughness of glass substrates after low-temperature bonding is investigated. It is found that plasma etching can be used to control the surface roughness to the range 2-9 nm. Substrates with a roughness of 5 nm or less can be bonded. The pressure capacity of devices tends to decrease with increasing surface roughness. A pressure capacity of 500 kPa or higher is obtained with a surface roughness of 2 nm or less. This criterion for bonding conditions can be applied to roughness formed by other methods (e.g. via a Cr layer). The proposed approach will facilitate the design and fabrication of glass micro/nanofluidic devices, especially those that complicated fabrication processes or embedding of multiple materials.
(Less)
- author
- Ohta, Ryoichi ; Morikawa, Kyojiro ; Tsuyama, Yoshiyuki and Kitamori, Takehiko LU
- organization
- publishing date
- 2024-01
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- glass bonding, glass channel fabrication, nanofluidics, surface roughness
- in
- Journal of Micromechanics and Microengineering
- volume
- 34
- issue
- 1
- article number
- 017002
- publisher
- IOP Publishing
- external identifiers
-
- scopus:85180101044
- ISSN
- 0960-1317
- DOI
- 10.1088/1361-6439/ad104c
- language
- English
- LU publication?
- yes
- id
- aa0cc4d9-cc5b-4d29-b955-29e4e6ba2c64
- date added to LUP
- 2024-01-31 14:12:36
- date last changed
- 2024-01-31 14:14:18
@misc{aa0cc4d9-cc5b-4d29-b955-29e4e6ba2c64,
abstract = {{<p>The bonding of glass substrates is an important process in the fabrication of glass micro/nanofluidic devices. In this study, the influence of the surface roughness of glass substrates after low-temperature bonding is investigated. It is found that plasma etching can be used to control the surface roughness to the range 2-9 nm. Substrates with a roughness of 5 nm or less can be bonded. The pressure capacity of devices tends to decrease with increasing surface roughness. A pressure capacity of 500 kPa or higher is obtained with a surface roughness of 2 nm or less. This criterion for bonding conditions can be applied to roughness formed by other methods (e.g. via a Cr layer). The proposed approach will facilitate the design and fabrication of glass micro/nanofluidic devices, especially those that complicated fabrication processes or embedding of multiple materials.</p>}},
author = {{Ohta, Ryoichi and Morikawa, Kyojiro and Tsuyama, Yoshiyuki and Kitamori, Takehiko}},
issn = {{0960-1317}},
keywords = {{glass bonding; glass channel fabrication; nanofluidics; surface roughness}},
language = {{eng}},
number = {{1}},
publisher = {{IOP Publishing}},
series = {{Journal of Micromechanics and Microengineering}},
title = {{Relationship between bonding strength and surface roughness in low-temperature bonding of glass for micro/nanofluidic device}},
url = {{http://dx.doi.org/10.1088/1361-6439/ad104c}},
doi = {{10.1088/1361-6439/ad104c}},
volume = {{34}},
year = {{2024}},
}