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The effect of interface topography for Ultrasonic Consolidation of aluminium

Friel, R. J. LU ; Johnson, K. E.; Dickens, P. M. and Harris, R. A. (2010) In Materials Science and Engineering A 527(16-17). p.4474-4483
Abstract

Ultrasonic Consolidation (UC) is an additive manufacturing technology which is based on the sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative process, to other metal-matrix embedding technologies, for 'smart' metal composite material production. A challenge that exists however relates to optimising, for bond density and plastic flow, the interlaminar textures themselves that serve as the contact surfaces between the foils.UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the processed metals surface that in turn becomes the crucial substrate... (More)

Ultrasonic Consolidation (UC) is an additive manufacturing technology which is based on the sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative process, to other metal-matrix embedding technologies, for 'smart' metal composite material production. A challenge that exists however relates to optimising, for bond density and plastic flow, the interlaminar textures themselves that serve as the contact surfaces between the foils.UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the processed metals surface that in turn becomes the crucial substrate topology of the subsequent layers deposition. This work investigated UC processed Al 3003 samples to ascertain the effect of this imparted topology on subsequent layer deposition. Surface and interlaminar topology profiles were characterised using interferometry, electron and light microscopy. The physical effect of the topology profiles was quantified via the use of peel testing.The imparted topology profile was found to be of fundamental significance to the mechanical performance and bond density achieved within the bulk laminate during UC. The UC process parameters and sonotrode topology performed a key role in modifying this topology profile. The concept of using a specifically textured sonotrode to attain desired future smart material performance via UC is proposed by the authors.

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Please use this url to cite or link to this publication:
author
publishing date
type
Contribution to journal
publication status
published
keywords
Additive manufacturing, Aluminium alloys, Light microscopy, Surface roughness, Ultrasonic Consolidation, Welding
in
Materials Science and Engineering A
volume
527
issue
16-17
pages
10 pages
publisher
Elsevier
external identifiers
  • scopus:77952880243
ISSN
0921-5093
DOI
10.1016/j.msea.2010.03.094
language
English
LU publication?
no
id
c3b7cc4c-0348-4169-b644-28a099aa7e12
date added to LUP
2017-01-23 09:51:45
date last changed
2018-06-03 04:53:01
@article{c3b7cc4c-0348-4169-b644-28a099aa7e12,
  abstract     = {<p>Ultrasonic Consolidation (UC) is an additive manufacturing technology which is based on the sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative process, to other metal-matrix embedding technologies, for 'smart' metal composite material production. A challenge that exists however relates to optimising, for bond density and plastic flow, the interlaminar textures themselves that serve as the contact surfaces between the foils.UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the processed metals surface that in turn becomes the crucial substrate topology of the subsequent layers deposition. This work investigated UC processed Al 3003 samples to ascertain the effect of this imparted topology on subsequent layer deposition. Surface and interlaminar topology profiles were characterised using interferometry, electron and light microscopy. The physical effect of the topology profiles was quantified via the use of peel testing.The imparted topology profile was found to be of fundamental significance to the mechanical performance and bond density achieved within the bulk laminate during UC. The UC process parameters and sonotrode topology performed a key role in modifying this topology profile. The concept of using a specifically textured sonotrode to attain desired future smart material performance via UC is proposed by the authors.</p>},
  author       = {Friel, R. J. and Johnson, K. E. and Dickens, P. M. and Harris, R. A.},
  issn         = {0921-5093},
  keyword      = {Additive manufacturing,Aluminium alloys,Light microscopy,Surface roughness,Ultrasonic Consolidation,Welding},
  language     = {eng},
  number       = {16-17},
  pages        = {4474--4483},
  publisher    = {Elsevier},
  series       = { Materials Science and Engineering A},
  title        = {The effect of interface topography for Ultrasonic Consolidation of aluminium},
  url          = {http://dx.doi.org/10.1016/j.msea.2010.03.094},
  volume       = {527},
  year         = {2010},
}