Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power
(2017) In Applied Thermal Engineering 121. p.180-189- Abstract
Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are... (More)
Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are investigated numerically. The results of the optimization show that despite a conflict between reducing the thermal resistance and lowering the pumping power, there is an appropriate structure of the double-layered countercurrent microchannel heat sink optimized by the NSGA-II optimization algorithm. For the selected cases, Case 4 has the best thermal performance, because Case 4 not only has a smaller pumping power than Case 0, but also has a smaller thermal resistance than Case 0. Therefore, it is indicated that better thermal performance of microchannel heat sinks can be achieved through the optimization algorithm.
(Less)
- author
- Shen, Han-Ming ; Jin, Xin ; Zhang, Fengli ; Xie, Gongnan LU ; Sunden, Bengt LU and Yan, Hongbin
- organization
- publishing date
- 2017-07-05
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Computational fluid dynamics, Microchannel heat sink, NSGA-II optimization algorithm, Pumping power, Thermal resistance
- in
- Applied Thermal Engineering
- volume
- 121
- pages
- 10 pages
- publisher
- Elsevier
- external identifiers
-
- scopus:85018561011
- wos:000406169600018
- ISSN
- 1359-4311
- DOI
- 10.1016/j.applthermaleng.2017.04.058
- language
- English
- LU publication?
- yes
- id
- e1777ea8-94e7-488c-aec7-78bbe40e98fd
- date added to LUP
- 2017-05-12 07:45:06
- date last changed
- 2024-05-26 15:37:04
@article{e1777ea8-94e7-488c-aec7-78bbe40e98fd,
abstract = {{<p>Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are investigated numerically. The results of the optimization show that despite a conflict between reducing the thermal resistance and lowering the pumping power, there is an appropriate structure of the double-layered countercurrent microchannel heat sink optimized by the NSGA-II optimization algorithm. For the selected cases, Case 4 has the best thermal performance, because Case 4 not only has a smaller pumping power than Case 0, but also has a smaller thermal resistance than Case 0. Therefore, it is indicated that better thermal performance of microchannel heat sinks can be achieved through the optimization algorithm.</p>}},
author = {{Shen, Han-Ming and Jin, Xin and Zhang, Fengli and Xie, Gongnan and Sunden, Bengt and Yan, Hongbin}},
issn = {{1359-4311}},
keywords = {{Computational fluid dynamics; Microchannel heat sink; NSGA-II optimization algorithm; Pumping power; Thermal resistance}},
language = {{eng}},
month = {{07}},
pages = {{180--189}},
publisher = {{Elsevier}},
series = {{Applied Thermal Engineering}},
title = {{Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power}},
url = {{http://dx.doi.org/10.1016/j.applthermaleng.2017.04.058}},
doi = {{10.1016/j.applthermaleng.2017.04.058}},
volume = {{121}},
year = {{2017}},
}