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Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power

Shen, Han-Ming; Jin, Xin; Zhang, Fengli; Xie, Gongnan LU ; Sunden, Bengt LU and Yan, Hongbin (2017) In Applied Thermal Engineering 121. p.180-189
Abstract

Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are... (More)

Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are investigated numerically. The results of the optimization show that despite a conflict between reducing the thermal resistance and lowering the pumping power, there is an appropriate structure of the double-layered countercurrent microchannel heat sink optimized by the NSGA-II optimization algorithm. For the selected cases, Case 4 has the best thermal performance, because Case 4 not only has a smaller pumping power than Case 0, but also has a smaller thermal resistance than Case 0. Therefore, it is indicated that better thermal performance of microchannel heat sinks can be achieved through the optimization algorithm.

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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Computational fluid dynamics, Microchannel heat sink, NSGA-II optimization algorithm, Pumping power, Thermal resistance
in
Applied Thermal Engineering
volume
121
pages
10 pages
publisher
Elsevier
external identifiers
  • scopus:85017903949
  • scopus:85018561011
  • wos:000406169600018
ISSN
1359-4311
DOI
10.1016/j.applthermaleng.2017.04.058
language
English
LU publication?
yes
id
e1777ea8-94e7-488c-aec7-78bbe40e98fd
date added to LUP
2017-05-12 07:45:06
date last changed
2017-09-18 11:35:41
@article{e1777ea8-94e7-488c-aec7-78bbe40e98fd,
  abstract     = {<p>Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are investigated numerically. The results of the optimization show that despite a conflict between reducing the thermal resistance and lowering the pumping power, there is an appropriate structure of the double-layered countercurrent microchannel heat sink optimized by the NSGA-II optimization algorithm. For the selected cases, Case 4 has the best thermal performance, because Case 4 not only has a smaller pumping power than Case 0, but also has a smaller thermal resistance than Case 0. Therefore, it is indicated that better thermal performance of microchannel heat sinks can be achieved through the optimization algorithm.</p>},
  author       = {Shen, Han-Ming and Jin, Xin and Zhang, Fengli and Xie, Gongnan and Sunden, Bengt and Yan, Hongbin},
  issn         = {1359-4311},
  keyword      = {Computational fluid dynamics,Microchannel heat sink,NSGA-II optimization algorithm,Pumping power,Thermal resistance},
  language     = {eng},
  month        = {07},
  pages        = {180--189},
  publisher    = {Elsevier},
  series       = {Applied Thermal Engineering},
  title        = {Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power},
  url          = {http://dx.doi.org/10.1016/j.applthermaleng.2017.04.058},
  volume       = {121},
  year         = {2017},
}