Tensile Behavior of Single-crystal Nanosized Copper Beams with Voids
(2017) In Solid State Phenomena 258. p.53-56- Abstract
- The tensile response under displacement controlled loading of nanosized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two... (More)
- The tensile response under displacement controlled loading of nanosized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/f506b2e0-16de-4e10-9e40-6e6aeea57f9e
- author
- Melin, Solveig LU ; Ahadi, Aylin LU and Hansson, Per LU
- organization
- publishing date
- 2017
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- MD simulation, Single crystal Cu, Tensile strength, Void size effects, Voids in nano-beams
- in
- Solid State Phenomena
- volume
- 258
- pages
- 3 pages
- publisher
- Trans Tech Publications
- ISSN
- 1012-0394
- DOI
- 10.4028/www.scientific.net/SSP.258.53
- project
- Modelling mechanical properties at nanoscale by molecular dynamics
- language
- English
- LU publication?
- yes
- id
- f506b2e0-16de-4e10-9e40-6e6aeea57f9e
- date added to LUP
- 2016-09-27 13:45:19
- date last changed
- 2021-09-23 04:00:44
@article{f506b2e0-16de-4e10-9e40-6e6aeea57f9e,
abstract = {{The tensile response under displacement controlled loading of nanosized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.}},
author = {{Melin, Solveig and Ahadi, Aylin and Hansson, Per}},
issn = {{1012-0394}},
keywords = {{MD simulation; Single crystal Cu; Tensile strength; Void size effects; Voids in nano-beams}},
language = {{eng}},
pages = {{53--56}},
publisher = {{Trans Tech Publications}},
series = {{Solid State Phenomena}},
title = {{Tensile Behavior of Single-crystal Nanosized Copper Beams with Voids}},
url = {{http://dx.doi.org/10.4028/www.scientific.net/SSP.258.53}},
doi = {{10.4028/www.scientific.net/SSP.258.53}},
volume = {{258}},
year = {{2017}},
}