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Coating engineering for boiling heat transfer toward immersion cooling

Cao, Zhen LU ; Wu, Zan LU ; Faghri, Mohammad and Sundén, Bengt LU (2021) In Advances in Heat Transfer
Abstract

With the technological advancements in electronics, thermal management is becoming a concern that considerably affects the performance of electronic parts and systems, and two-phase immersion cooling is attracting attention due to its preferable cooling capacity. In immersion cooling, heat is dissipated by boiling that occurs on hot surfaces immersed in coolants. Therefore, it is essential to investigate boiling towards the realization and optimization of immersion cooling. Extensive studies have been carried out in terms of boiling heat transfer, e.g., bubble dynamics, heat transfer mechanisms, and critical heat flux, which convincingly indicate that boiling heat transfer greatly depends on surface characteristics and liquid properties... (More)

With the technological advancements in electronics, thermal management is becoming a concern that considerably affects the performance of electronic parts and systems, and two-phase immersion cooling is attracting attention due to its preferable cooling capacity. In immersion cooling, heat is dissipated by boiling that occurs on hot surfaces immersed in coolants. Therefore, it is essential to investigate boiling towards the realization and optimization of immersion cooling. Extensive studies have been carried out in terms of boiling heat transfer, e.g., bubble dynamics, heat transfer mechanisms, and critical heat flux, which convincingly indicate that boiling heat transfer greatly depends on surface characteristics and liquid properties as well as interactions between surfaces and liquids. As a consequence, many technologies have been applied to tailor-made or engineered surfaces to achieve an enhancement in boiling. Accordingly, this chapter will concentrate on technologies that produce thin film coatings on target surfaces, like CPU and memories in electronics, enabling high-efficient boiling performance and having good compatibility with electronics. Specifically, the chapter will be organized mainly with the following sections: introduction, fundamentals of boiling, coating technologies for boiling enhancement, and exploration of the enhancement mechanism. Through this work, it is expected to provide general insights into boiling heat transfer and give suggestions regarding the future directions of boiling heat transfer research.

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Please use this url to cite or link to this publication:
author
; ; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
Bubble behavior, Critical heat flux, Heat transfer enhancement, Immersion cooling, Mechanistic modeling, Nucleate boiling, Pool boiling, Surface coating
host publication
Advances in Heat Transfer
series title
Advances in Heat Transfer
publisher
Academic Press
external identifiers
  • scopus:85111503821
ISSN
0065-2717
DOI
10.1016/bs.aiht.2021.06.002
language
English
LU publication?
yes
id
ff62f71e-7c35-4054-a584-ad11a4e91013
alternative location
https://www.sciencedirect.com/science/article/pii/S0065271721000022
date added to LUP
2021-08-31 10:09:08
date last changed
2023-11-08 18:24:30
@inbook{ff62f71e-7c35-4054-a584-ad11a4e91013,
  abstract     = {{<p>With the technological advancements in electronics, thermal management is becoming a concern that considerably affects the performance of electronic parts and systems, and two-phase immersion cooling is attracting attention due to its preferable cooling capacity. In immersion cooling, heat is dissipated by boiling that occurs on hot surfaces immersed in coolants. Therefore, it is essential to investigate boiling towards the realization and optimization of immersion cooling. Extensive studies have been carried out in terms of boiling heat transfer, e.g., bubble dynamics, heat transfer mechanisms, and critical heat flux, which convincingly indicate that boiling heat transfer greatly depends on surface characteristics and liquid properties as well as interactions between surfaces and liquids. As a consequence, many technologies have been applied to tailor-made or engineered surfaces to achieve an enhancement in boiling. Accordingly, this chapter will concentrate on technologies that produce thin film coatings on target surfaces, like CPU and memories in electronics, enabling high-efficient boiling performance and having good compatibility with electronics. Specifically, the chapter will be organized mainly with the following sections: introduction, fundamentals of boiling, coating technologies for boiling enhancement, and exploration of the enhancement mechanism. Through this work, it is expected to provide general insights into boiling heat transfer and give suggestions regarding the future directions of boiling heat transfer research.</p>}},
  author       = {{Cao, Zhen and Wu, Zan and Faghri, Mohammad and Sundén, Bengt}},
  booktitle    = {{Advances in Heat Transfer}},
  issn         = {{0065-2717}},
  keywords     = {{Bubble behavior; Critical heat flux; Heat transfer enhancement; Immersion cooling; Mechanistic modeling; Nucleate boiling; Pool boiling; Surface coating}},
  language     = {{eng}},
  month        = {{07}},
  publisher    = {{Academic Press}},
  series       = {{Advances in Heat Transfer}},
  title        = {{Coating engineering for boiling heat transfer toward immersion cooling}},
  url          = {{http://dx.doi.org/10.1016/bs.aiht.2021.06.002}},
  doi          = {{10.1016/bs.aiht.2021.06.002}},
  year         = {{2021}},
}