Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
(2012) In Journal of Electronic Packaging 134(4).- Abstract
- With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy... (More)
- With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. [DOI: 10.1115/1.4023035] (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/3508095
- author
- Xie, Gongnan ; Liu, Jian ; Zhang, Weihong and Sundén, Bengt LU
- organization
- publishing date
- 2012
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- transversal wavy microchannel, pressure drop, overall thermal, resistance, numerical simulation
- in
- Journal of Electronic Packaging
- volume
- 134
- issue
- 4
- article number
- 041010
- publisher
- American Society Of Mechanical Engineers (ASME)
- external identifiers
-
- wos:000313031000010
- scopus:84872035698
- ISSN
- 1043-7398
- DOI
- 10.1115/1.4023035
- language
- English
- LU publication?
- yes
- id
- c28b1b74-a205-4df0-a95c-a859e55e00c4 (old id 3508095)
- date added to LUP
- 2016-04-01 10:12:53
- date last changed
- 2022-04-12 03:07:26
@article{c28b1b74-a205-4df0-a95c-a859e55e00c4,
abstract = {{With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often designed to be straight with rectangular cross section. In this study, on the basis of a straight microchannel having rectangular cross section, a kind of transversal wavy microchannel is designed and then the laminar flow and heat transfer are investigated numerically. It is shown that for removing the identical load, the transversal wavy microchannel has great potential to reduce pressure drop compared to the straight microchannel, especially for higher wave amplitude at the same Reynolds number, indicating the overall thermal performance of the transversal wavy microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. [DOI: 10.1115/1.4023035]}},
author = {{Xie, Gongnan and Liu, Jian and Zhang, Weihong and Sundén, Bengt}},
issn = {{1043-7398}},
keywords = {{transversal wavy microchannel; pressure drop; overall thermal; resistance; numerical simulation}},
language = {{eng}},
number = {{4}},
publisher = {{American Society Of Mechanical Engineers (ASME)}},
series = {{Journal of Electronic Packaging}},
title = {{Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling}},
url = {{http://dx.doi.org/10.1115/1.4023035}},
doi = {{10.1115/1.4023035}},
volume = {{134}},
year = {{2012}},
}