A Bond Wire Connection Implementation at mm-Wave Active Microstrip Antenna
(2019) In IEEE Microwave and Wireless Components Letters 29(6). p.427-429- Abstract
A bond wire to microstrip line transition, featuring two impedance transformers, is presented for a mm-wave microstrip antenna and power amplifier (PA) integration using conventional bond wires. Simulated return loss bandwidth for the transition is 4 GHz with a minimum insertion loss of 1 dB. Measurement results for the designed active antenna are compared with measurements for a passive antenna and a standalone PA. The maximum gain is 29 dBi, compared with 16.7-dBi passive antenna maximum gain. The half-power gain bandwidth is 7%. The measured active antenna radiation pattern is in good agreement with simulations. The maximum deembedded PA output power is close to 9 dBm.
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/56892c46-b96b-4f44-8563-12be5bad68d9
- author
- Bondarik, Alexander LU ; Forsberg, Therese LU ; Sjöberg, Daniel LU ; Sjöland, Henrik LU and Tormänen, Markus LU
- organization
- publishing date
- 2019
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Antenna arrays, complementary metal-oxide-semiconductor (CMOS) ICs, interconnect and package modeling, millimeter-wave integrated circuits
- in
- IEEE Microwave and Wireless Components Letters
- volume
- 29
- issue
- 6
- article number
- 8703111
- pages
- 3 pages
- publisher
- IEEE - Institute of Electrical and Electronics Engineers Inc.
- external identifiers
-
- scopus:85067121326
- ISSN
- 1531-1309
- DOI
- 10.1109/LMWC.2019.2909855
- language
- English
- LU publication?
- yes
- id
- 56892c46-b96b-4f44-8563-12be5bad68d9
- date added to LUP
- 2019-07-01 08:37:59
- date last changed
- 2024-04-02 11:49:11
@article{56892c46-b96b-4f44-8563-12be5bad68d9, abstract = {{<p>A bond wire to microstrip line transition, featuring two impedance transformers, is presented for a mm-wave microstrip antenna and power amplifier (PA) integration using conventional bond wires. Simulated return loss bandwidth for the transition is 4 GHz with a minimum insertion loss of 1 dB. Measurement results for the designed active antenna are compared with measurements for a passive antenna and a standalone PA. The maximum gain is 29 dBi, compared with 16.7-dBi passive antenna maximum gain. The half-power gain bandwidth is 7%. The measured active antenna radiation pattern is in good agreement with simulations. The maximum deembedded PA output power is close to 9 dBm.</p>}}, author = {{Bondarik, Alexander and Forsberg, Therese and Sjöberg, Daniel and Sjöland, Henrik and Tormänen, Markus}}, issn = {{1531-1309}}, keywords = {{Antenna arrays; complementary metal-oxide-semiconductor (CMOS) ICs; interconnect and package modeling; millimeter-wave integrated circuits}}, language = {{eng}}, number = {{6}}, pages = {{427--429}}, publisher = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}}, series = {{IEEE Microwave and Wireless Components Letters}}, title = {{A Bond Wire Connection Implementation at mm-Wave Active Microstrip Antenna}}, url = {{http://dx.doi.org/10.1109/LMWC.2019.2909855}}, doi = {{10.1109/LMWC.2019.2909855}}, volume = {{29}}, year = {{2019}}, }