Stress analysis of highly constrained copper strips with through crack shaped voids using molecular dynamics
(2014) 7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7) 592-593. p.43-46- Abstract
- A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin strip between two stiff layers. The Lennard-Jones pair potential is used for the inter-atomic forces. The centrally placed crack shaped void is created by removing a few atoms inside the specimen. The crack is loaded perpendicular to the crack plane and the tensile stress is studied as it varies over the thickness of the strip. Comparisons with finite element calculations are made and the goal is to find a limit in model size beneath which the finite element (FE) solutions and linear elastic... (More)
- A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin strip between two stiff layers. The Lennard-Jones pair potential is used for the inter-atomic forces. The centrally placed crack shaped void is created by removing a few atoms inside the specimen. The crack is loaded perpendicular to the crack plane and the tensile stress is studied as it varies over the thickness of the strip. Comparisons with finite element calculations are made and the goal is to find a limit in model size beneath which the finite element (FE) solutions and linear elastic fracture mechanics (LEFM) lose their accuracy. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/4558612
- author
- Johansson, Dan LU ; Hansson, Per LU and Melin, Solveig LU
- organization
- publishing date
- 2014
- type
- Chapter in Book/Report/Conference proceeding
- publication status
- published
- subject
- keywords
- Fracture mechanics, Plane stress, Plane strain, Molecular dynamics
- host publication
- Materials Structure & Micromechanics of Fracture VII (Key Engineering Materials)
- volume
- 592-593
- pages
- 43 - 46
- publisher
- Trans Tech Publications
- conference name
- 7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7)
- conference location
- Brno, Czech Republic
- conference dates
- 2013-07-01 - 2013-07-03
- external identifiers
-
- wos:000336694400006
- scopus:84891890540
- ISSN
- 1013-9826
- DOI
- 10.4028/www.scientific.net/KEM.592-593.43
- project
- Atomistic Studies of Nanosized Copper Structures
- language
- English
- LU publication?
- yes
- id
- b9dcbfed-f1da-4995-b7e5-69acc7bf9b21 (old id 4558612)
- date added to LUP
- 2016-04-01 14:53:25
- date last changed
- 2022-01-28 03:04:25
@inproceedings{b9dcbfed-f1da-4995-b7e5-69acc7bf9b21, abstract = {{A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin strip between two stiff layers. The Lennard-Jones pair potential is used for the inter-atomic forces. The centrally placed crack shaped void is created by removing a few atoms inside the specimen. The crack is loaded perpendicular to the crack plane and the tensile stress is studied as it varies over the thickness of the strip. Comparisons with finite element calculations are made and the goal is to find a limit in model size beneath which the finite element (FE) solutions and linear elastic fracture mechanics (LEFM) lose their accuracy.}}, author = {{Johansson, Dan and Hansson, Per and Melin, Solveig}}, booktitle = {{Materials Structure & Micromechanics of Fracture VII (Key Engineering Materials)}}, issn = {{1013-9826}}, keywords = {{Fracture mechanics; Plane stress; Plane strain; Molecular dynamics}}, language = {{eng}}, pages = {{43--46}}, publisher = {{Trans Tech Publications}}, title = {{Stress analysis of highly constrained copper strips with through crack shaped voids using molecular dynamics}}, url = {{http://dx.doi.org/10.4028/www.scientific.net/KEM.592-593.43}}, doi = {{10.4028/www.scientific.net/KEM.592-593.43}}, volume = {{592-593}}, year = {{2014}}, }