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- 2023
-
Mark
A molecular dynamics study on the influence of vacancies and interstitial helium on mechanical properties of tungsten
(
- Contribution to journal › Article
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Mark
Molecular dynamics simulations of nanometric cutting of single crystal copper sheets using a diamond tool
2023) Tenth International Conference on Materials Structure & Micromecanics of fracture, MSMF10 In Procedia Structural Integrity 43. p.9-14(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
- 2022
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Mark
Molecular dynamic modelling of the combined influence from strain rate and temperature at tensile loading of nanosized single crystal Cu beams
(
- Contribution to journal › Article
- 2021
-
Mark
Simulation of nanometric cutting using molecular dynamics
2021) In Procedia CIRP(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
- 2020
-
Mark
Grain boundary influence on the mechanical response to tensile loading for nanosized Cu beams modelled by MD simulations
2020) 9th International Conference on Materials Structure and Micromechanics of Fracture, MSFM 2019 In Procedia Structural Integrity 23. p.137-142(
- Contribution to journal › Article
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Mark
Molecular dynamics modelling of metric scaling effects in nanosized Cu beams holding a grain boundary
(
- Contribution to journal › Article
- 2019
-
Mark
Dislocation Generation from Grain Boundaries in Nanosized Cu-beams
2019) The fourth International Symposium on Atomistic and Multiscale Modeling of Mechanics and Multiphysics(
- Contribution to conference › Abstract
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Mark
Grain boundary influence on the mechanical response to tensile loading for nano-sized metallic beams modelled by MD simulations
2019) Ninth International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
-
Mark
Grain boundary inflience at the nanoscale- a molecular dynamics investigation of Cu
2019) Svenska Mekanikdagarna(
- Contribution to conference › Other
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Mark
Shear anisotropy in Si-Cu interfaces on the atomic scale
(
- Contribution to journal › Article