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Sensitivity degradation in a tri-band GSM BiCMOS direct-conversion receiver caused by transient substrate heating

Mattisson, Sven LU ; Hagberg, Hans and Andreani, Pietro LU (2008) In IEEE Journal of Solid-State Circuits 43(2). p.486-496
Abstract
An analysis of transient thermal substrate effects impairing the sensitivity of the DCS path in a tri-band GSM/DCS/PCS BiCMOS radio receiver is presented in this paper. A simple thermal model of the substrate is employed, enabling concurrent electrothermal circuit-substrate simulations within a standard analog circuit simulator. Simulation results obtained with this approach match very closely the measured data, and are used to predict the sensitivity of different circuit layout configurations to thermal gradients in the substrate. Following the guidelines suggested by these analyses, a redesigned version of the receiver displays a sensitivity improvement of 2 dB to 4 dB.
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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
in
IEEE Journal of Solid-State Circuits
volume
43
issue
2
pages
486 - 496
publisher
IEEE--Institute of Electrical and Electronics Engineers Inc.
external identifiers
  • wos:000252813600018
  • scopus:38849136534
ISSN
0018-9200
DOI
10.1109/JSSC.2007.914306
language
English
LU publication?
yes
id
cf720c40-ef93-4811-b053-7af64e7bd174 (old id 1049676)
alternative location
http://ieeexplore.ieee.org/iel5/4/4444554/04444575.pdf?tp=&arnumber=4444575&isnumber=4444554
date added to LUP
2008-03-20 11:44:56
date last changed
2017-01-01 06:12:36
@article{cf720c40-ef93-4811-b053-7af64e7bd174,
  abstract     = {An analysis of transient thermal substrate effects impairing the sensitivity of the DCS path in a tri-band GSM/DCS/PCS BiCMOS radio receiver is presented in this paper. A simple thermal model of the substrate is employed, enabling concurrent electrothermal circuit-substrate simulations within a standard analog circuit simulator. Simulation results obtained with this approach match very closely the measured data, and are used to predict the sensitivity of different circuit layout configurations to thermal gradients in the substrate. Following the guidelines suggested by these analyses, a redesigned version of the receiver displays a sensitivity improvement of 2 dB to 4 dB.},
  author       = {Mattisson, Sven and Hagberg, Hans and Andreani, Pietro},
  issn         = {0018-9200},
  language     = {eng},
  number       = {2},
  pages        = {486--496},
  publisher    = {IEEE--Institute of Electrical and Electronics Engineers Inc.},
  series       = {IEEE Journal of Solid-State Circuits},
  title        = {Sensitivity degradation in a tri-band GSM BiCMOS direct-conversion receiver caused by transient substrate heating},
  url          = {http://dx.doi.org/10.1109/JSSC.2007.914306},
  volume       = {43},
  year         = {2008},
}