Sensitivity degradation in a tri-band GSM BiCMOS direct-conversion receiver caused by transient substrate heating
(2008) In IEEE Journal of Solid-State Circuits 43(2). p.486-496- Abstract
- An analysis of transient thermal substrate effects impairing the sensitivity of the DCS path in a tri-band GSM/DCS/PCS BiCMOS radio receiver is presented in this paper. A simple thermal model of the substrate is employed, enabling concurrent electrothermal circuit-substrate simulations within a standard analog circuit simulator. Simulation results obtained with this approach match very closely the measured data, and are used to predict the sensitivity of different circuit layout configurations to thermal gradients in the substrate. Following the guidelines suggested by these analyses, a redesigned version of the receiver displays a sensitivity improvement of 2 dB to 4 dB.
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/1049676
- author
- Mattisson, Sven LU ; Hagberg, Hans and Andreani, Pietro LU
- organization
- publishing date
- 2008
- type
- Contribution to journal
- publication status
- published
- subject
- in
- IEEE Journal of Solid-State Circuits
- volume
- 43
- issue
- 2
- pages
- 486 - 496
- publisher
- IEEE - Institute of Electrical and Electronics Engineers Inc.
- external identifiers
-
- wos:000252813600018
- scopus:38849136534
- ISSN
- 0018-9200
- DOI
- 10.1109/JSSC.2007.914306
- language
- English
- LU publication?
- yes
- id
- cf720c40-ef93-4811-b053-7af64e7bd174 (old id 1049676)
- alternative location
- http://ieeexplore.ieee.org/iel5/4/4444554/04444575.pdf?tp=&arnumber=4444575&isnumber=4444554
- date added to LUP
- 2016-04-01 14:22:55
- date last changed
- 2022-03-14 05:36:40
@article{cf720c40-ef93-4811-b053-7af64e7bd174, abstract = {{An analysis of transient thermal substrate effects impairing the sensitivity of the DCS path in a tri-band GSM/DCS/PCS BiCMOS radio receiver is presented in this paper. A simple thermal model of the substrate is employed, enabling concurrent electrothermal circuit-substrate simulations within a standard analog circuit simulator. Simulation results obtained with this approach match very closely the measured data, and are used to predict the sensitivity of different circuit layout configurations to thermal gradients in the substrate. Following the guidelines suggested by these analyses, a redesigned version of the receiver displays a sensitivity improvement of 2 dB to 4 dB.}}, author = {{Mattisson, Sven and Hagberg, Hans and Andreani, Pietro}}, issn = {{0018-9200}}, language = {{eng}}, number = {{2}}, pages = {{486--496}}, publisher = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}}, series = {{IEEE Journal of Solid-State Circuits}}, title = {{Sensitivity degradation in a tri-band GSM BiCMOS direct-conversion receiver caused by transient substrate heating}}, url = {{http://dx.doi.org/10.1109/JSSC.2007.914306}}, doi = {{10.1109/JSSC.2007.914306}}, volume = {{43}}, year = {{2008}}, }