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Dry release of suspended nanostructures

Forsen, E ; Davis, ZJ ; Dong, M ; Ghatnekar-Nilsson, Sara LU ; Montelius, Lars LU and Boisen, A (2004) In Microelectronic Engineering 73-74. p.487-490
Abstract
A dry release method for fabrication of suspended nanostructures is presented. The technique has been combined with an anti-stiction treatment for fabrication of nanocantilever based nanoelectromechanical systems (NEMS). The process combines a dry release method, using a supporting layer of photoresist which is removed using oxygen ashing in a reactive ion etcher (RIE), with CHF3 plasma induced deposition of an fluorocarbon (FC) film acting as an antistiction coating. All in a single RIE sequence. The dry release process is contamination free and batch process compatible. Furthermore, the technique enables long time storage and transportation of produced devices without the risk of stiction. By combining the dry release method with a... (More)
A dry release method for fabrication of suspended nanostructures is presented. The technique has been combined with an anti-stiction treatment for fabrication of nanocantilever based nanoelectromechanical systems (NEMS). The process combines a dry release method, using a supporting layer of photoresist which is removed using oxygen ashing in a reactive ion etcher (RIE), with CHF3 plasma induced deposition of an fluorocarbon (FC) film acting as an antistiction coating. All in a single RIE sequence. The dry release process is contamination free and batch process compatible. Furthermore, the technique enables long time storage and transportation of produced devices without the risk of stiction. By combining the dry release method with a plasma deposited anti-stiction coating both fabrication induced stiction, which is mainly caused by capillary forces originating from the dehydration of meniscuses formed between suspended structures and the substrate during processing, as well as in-use stiction, occurring during mechanical operation of the system, are avoided. (C) 2004 Elsevier B.V. All rights reserved. (Less)
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author
; ; ; ; and
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
dry release, nanoelectromechanical system, anti-stiction, suspended nanocantilever
in
Microelectronic Engineering
volume
73-74
pages
487 - 490
publisher
Elsevier
external identifiers
  • wos:000222145400086
  • scopus:2542429756
ISSN
1873-5568
DOI
10.1016/j.mee.2004.03.022
language
English
LU publication?
yes
id
14f6e6bd-388b-49ba-abb5-7b801477d373 (old id 274488)
date added to LUP
2016-04-01 12:32:50
date last changed
2022-03-13 19:22:02
@article{14f6e6bd-388b-49ba-abb5-7b801477d373,
  abstract     = {{A dry release method for fabrication of suspended nanostructures is presented. The technique has been combined with an anti-stiction treatment for fabrication of nanocantilever based nanoelectromechanical systems (NEMS). The process combines a dry release method, using a supporting layer of photoresist which is removed using oxygen ashing in a reactive ion etcher (RIE), with CHF3 plasma induced deposition of an fluorocarbon (FC) film acting as an antistiction coating. All in a single RIE sequence. The dry release process is contamination free and batch process compatible. Furthermore, the technique enables long time storage and transportation of produced devices without the risk of stiction. By combining the dry release method with a plasma deposited anti-stiction coating both fabrication induced stiction, which is mainly caused by capillary forces originating from the dehydration of meniscuses formed between suspended structures and the substrate during processing, as well as in-use stiction, occurring during mechanical operation of the system, are avoided. (C) 2004 Elsevier B.V. All rights reserved.}},
  author       = {{Forsen, E and Davis, ZJ and Dong, M and Ghatnekar-Nilsson, Sara and Montelius, Lars and Boisen, A}},
  issn         = {{1873-5568}},
  keywords     = {{dry release; nanoelectromechanical system; anti-stiction; suspended nanocantilever}},
  language     = {{eng}},
  pages        = {{487--490}},
  publisher    = {{Elsevier}},
  series       = {{Microelectronic Engineering}},
  title        = {{Dry release of suspended nanostructures}},
  url          = {{http://dx.doi.org/10.1016/j.mee.2004.03.022}},
  doi          = {{10.1016/j.mee.2004.03.022}},
  volume       = {{73-74}},
  year         = {{2004}},
}