Advanced

Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires

Wu, Phillip LU ; Samuelson, Lars LU and Linke, Heiner LU (2011) In Journal of Nanomaterials
Abstract
A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies. We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires. The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire... (More)
A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies. We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires. The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire planar or 3D electronic devices. (Less)
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
in
Journal of Nanomaterials
publisher
Hindawi Publishing Corporation
external identifiers
  • wos:000298423800001
  • scopus:84855179712
ISSN
1687-4129
DOI
10.1155/2011/268149
language
English
LU publication?
yes
id
a4879761-bc13-4a65-a31e-36995f167b9e (old id 2494410)
date added to LUP
2012-05-15 15:52:19
date last changed
2017-01-01 03:17:10
@article{a4879761-bc13-4a65-a31e-36995f167b9e,
  abstract     = {A vision and one of the next challenges in nanoelectronics is the 3D integration of nanowire building blocks. Here we show that capillary forces associated with a liquid-air meniscus between two nanowires provides a simple, controllable technique to bend vertical nanowires into designed, interconnected assemblies. We characterize the electric nature of the junctions between crossed nanowires in a lateral geometry, which is one type of basic unit that can be found in interconnected-bent vertical nanowires. The crossed nanowire junction is capacitive in nature, and we demonstrate that one nanowire can be used to field effect gate the other nanowire, allowing for the possibility to develop extremely narrow conducting channels in nanowire planar or 3D electronic devices.},
  articleno    = {268149},
  author       = {Wu, Phillip and Samuelson, Lars and Linke, Heiner},
  issn         = {1687-4129},
  language     = {eng},
  publisher    = {Hindawi Publishing Corporation},
  series       = {Journal of Nanomaterials},
  title        = {Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires},
  url          = {http://dx.doi.org/10.1155/2011/268149},
  year         = {2011},
}