Advanced

Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

Tenje, Maria LU ; Johansson, Alicia; Sánchez Noguerón, Encarnacion; Clausen, Bjarne; Calleja, Montserrat and Boisen, Anja (2005) In Microelectronic Engineering 78/79. p.152-157
Abstract
We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased... (More)
We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8. (Less)
Please use this url to cite or link to this publication:
author
publishing date
type
Contribution to journal
publication status
published
subject
in
Microelectronic Engineering
volume
78/79
pages
152 - 157
publisher
Elsevier
external identifiers
  • scopus:14944339740
ISSN
1873-5568
DOI
10.1016/j.mee.2004.12.021
language
English
LU publication?
no
id
b03c6d7d-b4de-42d8-b917-4c7ddcf49b91 (old id 3157974)
date added to LUP
2012-10-25 17:18:35
date last changed
2017-01-01 04:34:26
@article{b03c6d7d-b4de-42d8-b917-4c7ddcf49b91,
  abstract     = {We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.},
  author       = {Tenje, Maria and Johansson, Alicia and Sánchez Noguerón, Encarnacion and Clausen, Bjarne and Calleja, Montserrat and Boisen, Anja},
  issn         = {1873-5568},
  language     = {eng},
  pages        = {152--157},
  publisher    = {Elsevier},
  series       = {Microelectronic Engineering},
  title        = {Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold},
  url          = {http://dx.doi.org/10.1016/j.mee.2004.12.021},
  volume       = {78/79},
  year         = {2005},
}