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Improving stamps for 10 nm level wafer scale nanoimprint lithography

Beck, Marc LU ; Graczyk, Mariusz LU ; Maximov, Ivan LU ; Sarwe, Eva-Lena LU ; Ling, TGI; Keil, M and Montelius, Lars LU (2002) In Microelectronic Engineering 61-2. p.441-448
Abstract
The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
nanoimprint lithography, stamp, fluorosilane, anti-adhesion
in
Microelectronic Engineering
volume
61-2
pages
441 - 448
publisher
Elsevier
external identifiers
  • wos:000176594700059
  • scopus:0036643642
ISSN
1873-5568
DOI
10.1016/S0167-9317(02)00464-1
language
English
LU publication?
yes
id
1ad34a26-ce29-4214-92ce-2d3e7ed93f9d (old id 334084)
date added to LUP
2007-08-08 09:48:53
date last changed
2017-12-10 03:54:34
@article{1ad34a26-ce29-4214-92ce-2d3e7ed93f9d,
  abstract     = {The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.},
  author       = {Beck, Marc and Graczyk, Mariusz and Maximov, Ivan and Sarwe, Eva-Lena and Ling, TGI and Keil, M and Montelius, Lars},
  issn         = {1873-5568},
  keyword      = {nanoimprint lithography,stamp,fluorosilane,anti-adhesion},
  language     = {eng},
  pages        = {441--448},
  publisher    = {Elsevier},
  series       = {Microelectronic Engineering},
  title        = {Improving stamps for 10 nm level wafer scale nanoimprint lithography},
  url          = {http://dx.doi.org/10.1016/S0167-9317(02)00464-1},
  volume       = {61-2},
  year         = {2002},
}