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Scalable D-band antenna with coplanar and stacked parasitic elements for low-cost antenna-in-package

Cao, Yu-Yan LU orcid ; Lee, Dongseop ; An, Sining ; Hong, Wonbin and Lau, Buon Kiong LU orcid (2026) In IEEE Transactions on Components, Packaging and Manufacturing Technology
Abstract
The unquenchable thirst for bandwidth to support next-generation wireless systems is increasingly bringing D-band into the spotlight. This work proposes a scalable D-band patch antenna that features both coplanar and stacked parasitic patch structures. By leveraging inter-patch coupling, different coplanar parasitic elements are excited across different frequency bands, enabling multi-mode operation and thus a wideband response. To mitigate gain fluctuations caused by modal discontinuities, stacked parasitic patches are added and progressively shifted inward to improve the continuity and consistency of modal patterns by suppressing the undesired currents and hence aligning the modal patterns. The resulting antenna element achieves a flat... (More)
The unquenchable thirst for bandwidth to support next-generation wireless systems is increasingly bringing D-band into the spotlight. This work proposes a scalable D-band patch antenna that features both coplanar and stacked parasitic patch structures. By leveraging inter-patch coupling, different coplanar parasitic elements are excited across different frequency bands, enabling multi-mode operation and thus a wideband response. To mitigate gain fluctuations caused by modal discontinuities, stacked parasitic patches are added and progressively shifted inward to improve the continuity and consistency of modal patterns by suppressing the undesired currents and hence aligning the modal patterns. The resulting antenna element achieves a flat gain of up to 10 dBi over a 28% impedance bandwidth in simulation. To demonstrate the scalability of the design, a 2 times 2 array with a hybrid feed network was fabricated with a high-density interconnect (HDI) PCB process featuring one buildup layer on each side of a two-layer core. The array prototype yields an impedance bandwidth of 29%, a peak gain of 12.3 dB, and a gain bandwidth of 17.8%. These results highlight the strong potential of low-cost HDI-based antenna fabrication for D-band applications. (Less)
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author
; ; ; and
organization
publishing date
type
Contribution to journal
publication status
epub
subject
in
IEEE Transactions on Components, Packaging and Manufacturing Technology
publisher
IEEE - Institute of Electrical and Electronics Engineers Inc.
external identifiers
  • scopus:105035674116
ISSN
2156-3950
DOI
10.1109/TCPMT.2026.3681875
project
A Dual-frequency Distributed MIMO Approach for Future 6G Applications
language
English
LU publication?
yes
id
406f993a-533d-4ca3-9437-d135e5625481
date added to LUP
2026-05-20 17:58:15
date last changed
2026-06-04 10:39:33
@article{406f993a-533d-4ca3-9437-d135e5625481,
  abstract     = {{The unquenchable thirst for bandwidth to support next-generation wireless systems is increasingly bringing D-band into the spotlight. This work proposes a scalable D-band patch antenna that features both coplanar and stacked parasitic patch structures. By leveraging inter-patch coupling, different coplanar parasitic elements are excited across different frequency bands, enabling multi-mode operation and thus a wideband response. To mitigate gain fluctuations caused by modal discontinuities, stacked parasitic patches are added and progressively shifted inward to improve the continuity and consistency of modal patterns by suppressing the undesired currents and hence aligning the modal patterns. The resulting antenna element achieves a flat gain of up to 10 dBi over a 28% impedance bandwidth in simulation. To demonstrate the scalability of the design, a 2 times 2 array with a hybrid feed network was fabricated with a high-density interconnect (HDI) PCB process featuring one buildup layer on each side of a two-layer core. The array prototype yields an impedance bandwidth of 29%, a peak gain of 12.3 dB, and a gain bandwidth of 17.8%. These results highlight the strong potential of low-cost HDI-based antenna fabrication for D-band applications.}},
  author       = {{Cao, Yu-Yan and Lee, Dongseop and An, Sining and Hong, Wonbin and Lau, Buon Kiong}},
  issn         = {{2156-3950}},
  language     = {{eng}},
  month        = {{04}},
  publisher    = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}},
  series       = {{IEEE Transactions on Components, Packaging and Manufacturing Technology}},
  title        = {{Scalable D-band antenna with coplanar and stacked parasitic elements for low-cost antenna-in-package}},
  url          = {{https://lup.lub.lu.se/search/files/250687044/Scalable_D_Band_Antenna_with_Coplanar_and_Stacked_Parasitic_Elements_for_Low_Cost_Antenna_in_Package.pdf}},
  doi          = {{10.1109/TCPMT.2026.3681875}},
  year         = {{2026}},
}