ThermOS: System Support for Dynamic Thermal Management of Chip Multi-Processors
(2013) 22nd International Conference on Parallel Architectures and Compilation Techniques (PACT) p.41-50- Abstract
- Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while... (More)
- Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while software solutions can avoid this issue.
We propose ThermOS, a framework that harnesses formal, feedback control and idle cycle injection to reduce thermal emergencies while showing better efficiency than common dynamic thermal management techniques like dynamic voltage and frequency scaling. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/3787576
- author
- Sironi, Filippo ; Maggio, Martina LU ; Cattaneo, Riccardo ; Del Nero, Giovanni ; Sciuto, Donatella and Santambrogio, Marco Domenico
- organization
- publishing date
- 2013
- type
- Chapter in Book/Report/Conference proceeding
- publication status
- published
- subject
- keywords
- operating systems, thermal management
- host publication
- 22nd International Conference on Parallel Architectures and Compilation Techniques (PACT), 2013
- pages
- 41 - 50
- publisher
- IEEE - Institute of Electrical and Electronics Engineers Inc.
- conference name
- 22nd International Conference on Parallel Architectures and Compilation Techniques (PACT)
- conference location
- Endinburgh, Scotland, United Kingdom
- conference dates
- 2013-09-09
- external identifiers
-
- scopus:84887472335
- ISSN
- 1089-795X
- ISBN
- 978-1-4799-1018-2
- DOI
- 10.1109/PACT.2013.6618802
- language
- English
- LU publication?
- yes
- additional info
- Paper accepted for publication at PACT 2013.
- id
- 78b34cdb-9b23-49e1-a317-bf1c0e3754d6 (old id 3787576)
- date added to LUP
- 2016-04-01 13:10:48
- date last changed
- 2022-04-29 18:45:54
@inproceedings{78b34cdb-9b23-49e1-a317-bf1c0e3754d6, abstract = {{Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while software solutions can avoid this issue.<br/><br> <br/><br> We propose ThermOS, a framework that harnesses formal, feedback control and idle cycle injection to reduce thermal emergencies while showing better efficiency than common dynamic thermal management techniques like dynamic voltage and frequency scaling.}}, author = {{Sironi, Filippo and Maggio, Martina and Cattaneo, Riccardo and Del Nero, Giovanni and Sciuto, Donatella and Santambrogio, Marco Domenico}}, booktitle = {{22nd International Conference on Parallel Architectures and Compilation Techniques (PACT), 2013}}, isbn = {{978-1-4799-1018-2}}, issn = {{1089-795X}}, keywords = {{operating systems; thermal management}}, language = {{eng}}, pages = {{41--50}}, publisher = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}}, title = {{ThermOS: System Support for Dynamic Thermal Management of Chip Multi-Processors}}, url = {{http://dx.doi.org/10.1109/PACT.2013.6618802}}, doi = {{10.1109/PACT.2013.6618802}}, year = {{2013}}, }