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ThermOS: System Support for Dynamic Thermal Management of Chip Multi-Processors

Sironi, Filippo ; Maggio, Martina LU ; Cattaneo, Riccardo ; Del Nero, Giovanni ; Sciuto, Donatella and Santambrogio, Marco Domenico (2013) 22nd International Conference on Parallel Architectures and Compilation Techniques (PACT) p.41-50
Abstract
Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while... (More)
Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while software solutions can avoid this issue.



We propose ThermOS, a framework that harnesses formal, feedback control and idle cycle injection to reduce thermal emergencies while showing better efficiency than common dynamic thermal management techniques like dynamic voltage and frequency scaling. (Less)
Please use this url to cite or link to this publication:
author
; ; ; ; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
operating systems, thermal management
host publication
22nd International Conference on Parallel Architectures and Compilation Techniques (PACT), 2013
pages
41 - 50
publisher
IEEE - Institute of Electrical and Electronics Engineers Inc.
conference name
22nd International Conference on Parallel Architectures and Compilation Techniques (PACT)
conference location
Endinburgh, Scotland, United Kingdom
conference dates
2013-09-09
external identifiers
  • scopus:84887472335
ISSN
1089-795X
ISBN
978-1-4799-1018-2
DOI
10.1109/PACT.2013.6618802
language
English
LU publication?
yes
additional info
Paper accepted for publication at PACT 2013.
id
78b34cdb-9b23-49e1-a317-bf1c0e3754d6 (old id 3787576)
date added to LUP
2016-04-01 13:10:48
date last changed
2022-04-29 18:45:54
@inproceedings{78b34cdb-9b23-49e1-a317-bf1c0e3754d6,
  abstract     = {{Constraining the temperature of computing systems has become a dominant design aspect. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to trade-off performance for energy consumption, thus reducing power density and temperature. Software dynamic thermal management displayed some advantages with respect to hardware solutions found in chip multi-processors. Hardware dynamic thermal management indiscriminately trades-off performance for energy consumption, possibly affecting established service-level agreements, while software solutions can avoid this issue.<br/><br>
<br/><br>
We propose ThermOS, a framework that harnesses formal, feedback control and idle cycle injection to reduce thermal emergencies while showing better efficiency than common dynamic thermal management techniques like dynamic voltage and frequency scaling.}},
  author       = {{Sironi, Filippo and Maggio, Martina and Cattaneo, Riccardo and Del Nero, Giovanni and Sciuto, Donatella and Santambrogio, Marco Domenico}},
  booktitle    = {{22nd International Conference on Parallel Architectures and Compilation Techniques (PACT), 2013}},
  isbn         = {{978-1-4799-1018-2}},
  issn         = {{1089-795X}},
  keywords     = {{operating systems; thermal management}},
  language     = {{eng}},
  pages        = {{41--50}},
  publisher    = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}},
  title        = {{ThermOS: System Support for Dynamic Thermal Management of Chip Multi-Processors}},
  url          = {{http://dx.doi.org/10.1109/PACT.2013.6618802}},
  doi          = {{10.1109/PACT.2013.6618802}},
  year         = {{2013}},
}