Computational multiscale modelling of material interfaces in electrical conductors
(2024) In Journal of the Mechanics and Physics of Solids 186.- Abstract
Material interfaces occur at various length scales and may exhibit significantly different properties than the surrounding bulk. Motivated by their importance for electrical engineering applications such as wire bonds and electrically conductive adhesives, the focus of the present work is on material interfaces in electrical conductors. In order to approximate the physical interphase (of finite thickness) as a (zero-thickness) cohesive zone-type interface in macroscale simulations, scale-bridging relations are established that relate the apparent electro-mechanical interface properties to the underlying microstructure. A finite element-based implementation is discussed with particular focus lying on the efficient calculation of the... (More)
Material interfaces occur at various length scales and may exhibit significantly different properties than the surrounding bulk. Motivated by their importance for electrical engineering applications such as wire bonds and electrically conductive adhesives, the focus of the present work is on material interfaces in electrical conductors. In order to approximate the physical interphase (of finite thickness) as a (zero-thickness) cohesive zone-type interface in macroscale simulations, scale-bridging relations are established that relate the apparent electro-mechanical interface properties to the underlying microstructure. A finite element-based implementation is discussed with particular focus lying on the efficient calculation of the flux-type macroscale quantities and the associated generalised algorithmic consistent tangent stiffness tensors. Analytical solutions are derived for validation purposes and representative boundary value problems are studied.
(Less)
- author
- Kaiser, Tobias ; von der Höh, Niklas and Menzel, Andreas LU
- organization
- publishing date
- 2024-05
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Cohesive zone formulations, Conductors, Electro-mechanical coupling, Material interfaces, Multiscale simulations, Scale-bridging
- in
- Journal of the Mechanics and Physics of Solids
- volume
- 186
- article number
- 105601
- publisher
- Elsevier
- external identifiers
-
- scopus:85188250204
- ISSN
- 0022-5096
- DOI
- 10.1016/j.jmps.2024.105601
- language
- English
- LU publication?
- yes
- id
- 7f9d1df8-1276-4bc1-942c-50beecabd5f7
- date added to LUP
- 2024-03-27 13:16:45
- date last changed
- 2024-03-27 13:17:24
@article{7f9d1df8-1276-4bc1-942c-50beecabd5f7,
abstract = {{<p>Material interfaces occur at various length scales and may exhibit significantly different properties than the surrounding bulk. Motivated by their importance for electrical engineering applications such as wire bonds and electrically conductive adhesives, the focus of the present work is on material interfaces in electrical conductors. In order to approximate the physical interphase (of finite thickness) as a (zero-thickness) cohesive zone-type interface in macroscale simulations, scale-bridging relations are established that relate the apparent electro-mechanical interface properties to the underlying microstructure. A finite element-based implementation is discussed with particular focus lying on the efficient calculation of the flux-type macroscale quantities and the associated generalised algorithmic consistent tangent stiffness tensors. Analytical solutions are derived for validation purposes and representative boundary value problems are studied.</p>}},
author = {{Kaiser, Tobias and von der Höh, Niklas and Menzel, Andreas}},
issn = {{0022-5096}},
keywords = {{Cohesive zone formulations; Conductors; Electro-mechanical coupling; Material interfaces; Multiscale simulations; Scale-bridging}},
language = {{eng}},
publisher = {{Elsevier}},
series = {{Journal of the Mechanics and Physics of Solids}},
title = {{Computational multiscale modelling of material interfaces in electrical conductors}},
url = {{http://dx.doi.org/10.1016/j.jmps.2024.105601}},
doi = {{10.1016/j.jmps.2024.105601}},
volume = {{186}},
year = {{2024}},
}