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Ternary intermetallic compounds in Au-Sn soldering systems-structure and properties

Müller, Carola LU ; Bushlya, Volodymyr LU ; Ghasemi, Masoomeh; Lidin, Sven LU ; Valldor, Martin and Wang, Fei LU (2015) In Journal of Materials Science 50(23). p.7808-7820
Abstract
The intermetallic compound AuSn is essential for the wetting of Au-rich AuSn solders. On the addition of In or Sb, pseudo-binary compounds AuSn1-x In (x) (x a parts per thousand currency sign 0.33) and AuSn1-y Sb (y) (y a parts per thousand currency sign 0.17) are formed. Both adopt the AuSn structure type (P6(3)/mmc, Z = 2). This single-crystal X-ray diffraction study reveals that there is an absence of superstructure ordering upon long-time annealing (years). This behavior constitutes a surprising contrast to the related compounds in the systems Cu-In-Sn and Cu-Sn-Sb. As subsequent total energy calculations disclose, superstructure ordering is neither expected at 0 K nor by the application of high pressure. Hence, decomposition to AuSn... (More)
The intermetallic compound AuSn is essential for the wetting of Au-rich AuSn solders. On the addition of In or Sb, pseudo-binary compounds AuSn1-x In (x) (x a parts per thousand currency sign 0.33) and AuSn1-y Sb (y) (y a parts per thousand currency sign 0.17) are formed. Both adopt the AuSn structure type (P6(3)/mmc, Z = 2). This single-crystal X-ray diffraction study reveals that there is an absence of superstructure ordering upon long-time annealing (years). This behavior constitutes a surprising contrast to the related compounds in the systems Cu-In-Sn and Cu-Sn-Sb. As subsequent total energy calculations disclose, superstructure ordering is neither expected at 0 K nor by the application of high pressure. Hence, decomposition to AuSn and its neighboring phases in the ternary phase diagrams is the only way to release chemical pressure quickly. However, the ternary phases are formed at the expense of the binary compound AuSn, when moving away from the ideal composition. To give an idea how additions of In and Sb will affect the performance of AuSn in the solder joint, we studied the physical properties such as magnetism and resistance as well as mechanical properties such as hardness, elastic modulus, and fracture behavior. (Less)
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author
organization
publishing date
type
Contribution to journal
publication status
published
subject
in
Journal of Materials Science
volume
50
issue
23
pages
7808 - 7820
publisher
Springer
external identifiers
  • wos:000361526200028
  • scopus:84942365194
ISSN
0022-2461
DOI
10.1007/s10853-015-9352-y
language
English
LU publication?
yes
id
b7381ff1-abf1-472d-a433-2bd16d2cbe5b (old id 8071086)
date added to LUP
2015-10-22 09:19:55
date last changed
2017-01-01 05:51:51
@article{b7381ff1-abf1-472d-a433-2bd16d2cbe5b,
  abstract     = {The intermetallic compound AuSn is essential for the wetting of Au-rich AuSn solders. On the addition of In or Sb, pseudo-binary compounds AuSn1-x In (x) (x a parts per thousand currency sign 0.33) and AuSn1-y Sb (y) (y a parts per thousand currency sign 0.17) are formed. Both adopt the AuSn structure type (P6(3)/mmc, Z = 2). This single-crystal X-ray diffraction study reveals that there is an absence of superstructure ordering upon long-time annealing (years). This behavior constitutes a surprising contrast to the related compounds in the systems Cu-In-Sn and Cu-Sn-Sb. As subsequent total energy calculations disclose, superstructure ordering is neither expected at 0 K nor by the application of high pressure. Hence, decomposition to AuSn and its neighboring phases in the ternary phase diagrams is the only way to release chemical pressure quickly. However, the ternary phases are formed at the expense of the binary compound AuSn, when moving away from the ideal composition. To give an idea how additions of In and Sb will affect the performance of AuSn in the solder joint, we studied the physical properties such as magnetism and resistance as well as mechanical properties such as hardness, elastic modulus, and fracture behavior.},
  author       = {Müller, Carola and Bushlya, Volodymyr and Ghasemi, Masoomeh and Lidin, Sven and Valldor, Martin and Wang, Fei},
  issn         = {0022-2461},
  language     = {eng},
  number       = {23},
  pages        = {7808--7820},
  publisher    = {Springer},
  series       = {Journal of Materials Science},
  title        = {Ternary intermetallic compounds in Au-Sn soldering systems-structure and properties},
  url          = {http://dx.doi.org/10.1007/s10853-015-9352-y},
  volume       = {50},
  year         = {2015},
}