Sloped side walls in SU-8 structures with ‘Step-and-Flash’ processing
(2006) In Microelectronic Engineering 83(4/9). p.1269-1272- Abstract
- We present a fast fabrication technique to achieve SU-8 structures with sloped side walls. We investigate the method of ‘Step-and-Flash’ which combines hot embossing with UV sensitive materials. The stamps are fabricated in Si by KOH etching to achieve mesa structures with side walls at a 54.7° angle to the bottom. These stamps are imprinted into SU-8-coated Pyrex wafers during the soft bake step of the SU-8 processing, under ambient conditions. The SU-8 is exposed through the Pyrex wafer and after a post exposure bake the stamp can be removed as the SU-8 is cross-linked – leaving stamp replicates in the SU-8. We have optimized the method and show that further processing of the structures is possible. We believe this method to be highly... (More)
- We present a fast fabrication technique to achieve SU-8 structures with sloped side walls. We investigate the method of ‘Step-and-Flash’ which combines hot embossing with UV sensitive materials. The stamps are fabricated in Si by KOH etching to achieve mesa structures with side walls at a 54.7° angle to the bottom. These stamps are imprinted into SU-8-coated Pyrex wafers during the soft bake step of the SU-8 processing, under ambient conditions. The SU-8 is exposed through the Pyrex wafer and after a post exposure bake the stamp can be removed as the SU-8 is cross-linked – leaving stamp replicates in the SU-8. We have optimized the method and show that further processing of the structures is possible. We believe this method to be highly suitable for pattering sloped side wall structures in SU-8 as it can easily be incorporated into a standard SU-8 fabrication scheme without adding further process steps, as well as performed under ambient conditions. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/3131703
- author
- Nordström, Maria LU ; Hübner, Jörg and Boisen, Anja
- publishing date
- 2006
- type
- Contribution to journal
- publication status
- published
- subject
- in
- Microelectronic Engineering
- volume
- 83
- issue
- 4/9
- pages
- 1269 - 1272
- publisher
- Elsevier
- external identifiers
-
- scopus:33646067766
- ISSN
- 1873-5568
- DOI
- 10.1016/j.mee.2006.01.185
- language
- English
- LU publication?
- no
- id
- 9a09595f-4360-4c95-9444-f407e813c98b (old id 3131703)
- date added to LUP
- 2016-04-01 12:19:40
- date last changed
- 2022-01-27 02:07:16
@article{9a09595f-4360-4c95-9444-f407e813c98b,
abstract = {{We present a fast fabrication technique to achieve SU-8 structures with sloped side walls. We investigate the method of ‘Step-and-Flash’ which combines hot embossing with UV sensitive materials. The stamps are fabricated in Si by KOH etching to achieve mesa structures with side walls at a 54.7° angle to the bottom. These stamps are imprinted into SU-8-coated Pyrex wafers during the soft bake step of the SU-8 processing, under ambient conditions. The SU-8 is exposed through the Pyrex wafer and after a post exposure bake the stamp can be removed as the SU-8 is cross-linked – leaving stamp replicates in the SU-8. We have optimized the method and show that further processing of the structures is possible. We believe this method to be highly suitable for pattering sloped side wall structures in SU-8 as it can easily be incorporated into a standard SU-8 fabrication scheme without adding further process steps, as well as performed under ambient conditions.}},
author = {{Nordström, Maria and Hübner, Jörg and Boisen, Anja}},
issn = {{1873-5568}},
language = {{eng}},
number = {{4/9}},
pages = {{1269--1272}},
publisher = {{Elsevier}},
series = {{Microelectronic Engineering}},
title = {{Sloped side walls in SU-8 structures with ‘Step-and-Flash’ processing}},
url = {{http://dx.doi.org/10.1016/j.mee.2006.01.185}},
doi = {{10.1016/j.mee.2006.01.185}},
volume = {{83}},
year = {{2006}},
}