Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold
(2005) In Microelectronic Engineering 78/79. p.152-157- Abstract
- We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased... (More)
- We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/3157974
- author
- Nordström, Maria LU ; Johansson, Alicia ; Sánchez Noguerón, Encarnacion ; Clausen, Bjarne ; Calleja, Montserrat and Boisen, Anja
- publishing date
- 2005
- type
- Contribution to journal
- publication status
- published
- subject
- in
- Microelectronic Engineering
- volume
- 78/79
- pages
- 152 - 157
- publisher
- Elsevier
- external identifiers
-
- scopus:14944339740
- ISSN
- 1873-5568
- DOI
- 10.1016/j.mee.2004.12.021
- language
- English
- LU publication?
- no
- id
- b03c6d7d-b4de-42d8-b917-4c7ddcf49b91 (old id 3157974)
- date added to LUP
- 2016-04-01 11:49:12
- date last changed
- 2022-01-26 18:41:21
@article{b03c6d7d-b4de-42d8-b917-4c7ddcf49b91, abstract = {{We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.}}, author = {{Nordström, Maria and Johansson, Alicia and Sánchez Noguerón, Encarnacion and Clausen, Bjarne and Calleja, Montserrat and Boisen, Anja}}, issn = {{1873-5568}}, language = {{eng}}, pages = {{152--157}}, publisher = {{Elsevier}}, series = {{Microelectronic Engineering}}, title = {{Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold}}, url = {{http://dx.doi.org/10.1016/j.mee.2004.12.021}}, doi = {{10.1016/j.mee.2004.12.021}}, volume = {{78/79}}, year = {{2005}}, }