Stacking of heterostructures and metallic elements for a submicron resonant tunneling transistor
(2002) Proceedings of 7th International Conference on Nanometer-Scale Science and Technology and 21st European Conference on Surface Science (NANO-7/ECOSS-21)- Abstract
 - We have successfully embedded a metal gate in-between two resonant tunneling double barrier heterostructures (RTD), thus realizing a three dimensional resonant tunneling transistor. The gate is placed 30 nm above and 100 below the two RTD's, respectively. The asymmetric gate allows for a unique control of the current-voltage characteristics, not only controlling the peak current but also the peak voltage. We have modeled the transistor with Cadence, a standard simulation package for circuit simulations, achieving good agreement with experimental data
 
    Please use this url to cite or link to this publication:
    https://lup.lub.lu.se/record/610805
- author
 - 						Lind, Erik
				LU
				
	; 						Lindström, Peter
				LU
	; 						Pietzonka, I.
	; 						Seifert, Werner
				LU
	 and 						Wernersson, Lars-Erik
				LU
	 - organization
 - publishing date
 - 2002
 - type
 - Chapter in Book/Report/Conference proceeding
 - publication status
 - published
 - subject
 - keywords
 - circuit simulations, peak voltage, simulation package, stacking, peak current, heterostructures, metallic elements, submicron resonant tunneling transistor, metal gate, resonant tunneling double barrier heterostructures, three dimensional resonant tunneling transistor, current-voltage characteristics, asymmetric gate, 30 to 100 nm, W-GaAs
 - host publication
 - 7th International Conference on Nanometer-Scale Science and Technology and 21st European Conference on Surface Science
 - pages
 - 2 pages
 - publisher
 - Lund University
 - conference name
 - Proceedings of 7th International Conference on Nanometer-Scale Science and Technology and 21st European Conference on Surface Science (NANO-7/ECOSS-21)
 - conference location
 - Malmö, Sweden
 - conference dates
 - 2002-06-24 - 2002-06-28
 - language
 - English
 - LU publication?
 - yes
 - id
 - be8ffa1c-d92a-48fe-9977-90250104b345 (old id 610805)
 - date added to LUP
 - 2016-04-04 11:00:42
 - date last changed
 - 2025-04-04 15:09:44
 
@inproceedings{be8ffa1c-d92a-48fe-9977-90250104b345,
  abstract     = {{We have successfully embedded a metal gate in-between two resonant tunneling double barrier heterostructures (RTD), thus realizing a three dimensional resonant tunneling transistor. The gate is placed 30 nm above and 100 below the two RTD's, respectively. The asymmetric gate allows for a unique control of the current-voltage characteristics, not only controlling the peak current but also the peak voltage. We have modeled the transistor with Cadence, a standard simulation package for circuit simulations, achieving good agreement with experimental data}},
  author       = {{Lind, Erik and Lindström, Peter and Pietzonka, I. and Seifert, Werner and Wernersson, Lars-Erik}},
  booktitle    = {{7th International Conference on Nanometer-Scale Science and Technology and 21st European Conference on Surface Science}},
  keywords     = {{circuit simulations; peak voltage; simulation package; stacking; peak current; heterostructures; metallic elements; submicron resonant tunneling transistor; metal gate; resonant tunneling double barrier heterostructures; three dimensional resonant tunneling transistor; current-voltage characteristics; asymmetric gate; 30 to 100 nm; W-GaAs}},
  language     = {{eng}},
  publisher    = {{Lund University}},
  title        = {{Stacking of heterostructures and metallic elements for a submicron resonant tunneling transistor}},
  year         = {{2002}},
}