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2021
Mark Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns
Li, Jiujuan ; Hong, Yan ; Zhou, Guoyun ; Zhang, Huaiwu ; He, Wei ; Wang, Shouxu ; Chen, Yuanming ; Wang, Chong ; Su, Xinhong and Sun, Yukai , et al. (2021) In Journal of the Taiwan Institute of Chemical Engineers 123. p.254-260
- Contribution to journal › Article