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Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns

Li, Jiujuan ; Hong, Yan ; Zhou, Guoyun ; Zhang, Huaiwu ; He, Wei ; Wang, Shouxu ; Chen, Yuanming ; Wang, Chong ; Su, Xinhong and Sun, Yukai , et al. (2021) In Journal of the Taiwan Institute of Chemical Engineers 123. p.254-260
Abstract

Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film). The work function of the PT-based Cu/Ag composite film decreased from 4.822 eV of pure PT to 4.638 eV, which serves as a seed layer to prepare conductive circuits by the additive process. The method without the metal etching and photolithography steps solves the problems of conventional subtractive processes for forming conductive patterns.... (More)

Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film). The work function of the PT-based Cu/Ag composite film decreased from 4.822 eV of pure PT to 4.638 eV, which serves as a seed layer to prepare conductive circuits by the additive process. The method without the metal etching and photolithography steps solves the problems of conventional subtractive processes for forming conductive patterns. Besides, the PT-based Cu/Ag composite film is able to increase the roughness of the substrate to improve the bonding force between the electroplated copper layer and the substrate. Moreover, due to the particularity of oxidation solution for preparing the PT-based Cu/Ag composite film, conductive lines and patterns can be selectively formed on insulating substrate with arbitrary shapes by the additive process.

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publishing date
type
Contribution to journal
publication status
published
subject
keywords
Additive process, Bonding force, Conductive pattern, Multi-dimension, Polymer-based
in
Journal of the Taiwan Institute of Chemical Engineers
volume
123
pages
7 pages
publisher
Taiwan Institute of Chemical Engineers
external identifiers
  • scopus:85108943123
ISSN
1876-1070
DOI
10.1016/j.jtice.2021.05.033
language
English
LU publication?
yes
id
d79b4eee-f86e-465a-9af0-c97f01c3d690
date added to LUP
2021-08-20 11:26:59
date last changed
2022-04-27 03:20:29
@article{d79b4eee-f86e-465a-9af0-c97f01c3d690,
  abstract     = {{<p>Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film). The work function of the PT-based Cu/Ag composite film decreased from 4.822 eV of pure PT to 4.638 eV, which serves as a seed layer to prepare conductive circuits by the additive process. The method without the metal etching and photolithography steps solves the problems of conventional subtractive processes for forming conductive patterns. Besides, the PT-based Cu/Ag composite film is able to increase the roughness of the substrate to improve the bonding force between the electroplated copper layer and the substrate. Moreover, due to the particularity of oxidation solution for preparing the PT-based Cu/Ag composite film, conductive lines and patterns can be selectively formed on insulating substrate with arbitrary shapes by the additive process.</p>}},
  author       = {{Li, Jiujuan and Hong, Yan and Zhou, Guoyun and Zhang, Huaiwu and He, Wei and Wang, Shouxu and Chen, Yuanming and Wang, Chong and Su, Xinhong and Sun, Yukai and Andersson, Martin}},
  issn         = {{1876-1070}},
  keywords     = {{Additive process; Bonding force; Conductive pattern; Multi-dimension; Polymer-based}},
  language     = {{eng}},
  pages        = {{254--260}},
  publisher    = {{Taiwan Institute of Chemical Engineers}},
  series       = {{Journal of the Taiwan Institute of Chemical Engineers}},
  title        = {{Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns}},
  url          = {{http://dx.doi.org/10.1016/j.jtice.2021.05.033}},
  doi          = {{10.1016/j.jtice.2021.05.033}},
  volume       = {{123}},
  year         = {{2021}},
}