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- 2017
-
Mark
Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
2017) 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE In Solid State Phenomena 258 SSP. p.25-28(
- Contribution to journal › Article
- 2016
-
Mark
Indentation of thin copper film using molecular dynamics and peridynamics
(
- Contribution to journal › Article
- 2014
-
Mark
Indentation of thin copper film using peridynamics
2014) Nordic Seminar on Computational Mechanics, 2014(
- Contribution to conference › Paper, not in proceeding