Stress and displacement configurations in the vicinity of a void in a nanometer copper strip
(2016) In Engineering Fracture Mechanics 152. p.139-146- Abstract
Molecular dynamics is used to simulate nanometer-sized copper strips. The strips are highly constrained and chosen to mimic thin films between two stiff layers. Further, the strips hold centrally placed straight through crack shaped voids, and are subjected to tensile displacement controlled mode I loading. The tensile stresses and displacements are studied. It is found that if a copper strip is 2.16906. nm in a direction orthogonal to the loading direction, the strip does not experience plane strain conditions. However, if this dimension is ≥3.6151. nm, the strip shows states of both plane stress and plane strain.
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/6647489b-7ce8-44c4-86ae-0ef71232bc4d
- author
- Johansson, Dan LU ; Hansson, Per LU and Melin, Solveig LU
- organization
- publishing date
- 2016-02-01
- type
- Contribution to journal
- publication status
- published
- subject
- keywords
- Fracture mechanics, Molecular dynamics, Plane strain, Plane stress, Size dependence nano-sized strip
- in
- Engineering Fracture Mechanics
- volume
- 152
- pages
- 8 pages
- publisher
- Elsevier
- external identifiers
-
- wos:000369607300010
- scopus:84955666631
- ISSN
- 0013-7944
- DOI
- 10.1016/j.engfracmech.2015.07.033
- project
- Atomistic Studies of Nanosized Copper Structures
- language
- English
- LU publication?
- yes
- id
- 6647489b-7ce8-44c4-86ae-0ef71232bc4d
- date added to LUP
- 2016-06-23 07:52:03
- date last changed
- 2024-10-04 21:56:47
@article{6647489b-7ce8-44c4-86ae-0ef71232bc4d, abstract = {{<p>Molecular dynamics is used to simulate nanometer-sized copper strips. The strips are highly constrained and chosen to mimic thin films between two stiff layers. Further, the strips hold centrally placed straight through crack shaped voids, and are subjected to tensile displacement controlled mode I loading. The tensile stresses and displacements are studied. It is found that if a copper strip is 2.16906. nm in a direction orthogonal to the loading direction, the strip does not experience plane strain conditions. However, if this dimension is ≥3.6151. nm, the strip shows states of both plane stress and plane strain.</p>}}, author = {{Johansson, Dan and Hansson, Per and Melin, Solveig}}, issn = {{0013-7944}}, keywords = {{Fracture mechanics; Molecular dynamics; Plane strain; Plane stress; Size dependence nano-sized strip}}, language = {{eng}}, month = {{02}}, pages = {{139--146}}, publisher = {{Elsevier}}, series = {{Engineering Fracture Mechanics}}, title = {{Stress and displacement configurations in the vicinity of a void in a nanometer copper strip}}, url = {{http://dx.doi.org/10.1016/j.engfracmech.2015.07.033}}, doi = {{10.1016/j.engfracmech.2015.07.033}}, volume = {{152}}, year = {{2016}}, }