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- 2025
-
Mark
Thermomechanical analysis of liquid food packaging material in COMSOL Multiphysics
- Prof. qual. >4 yrs
-
Mark
Virtual representation of a Differential Scanning Calorimetry test
- Prof. qual. >4 yrs
- 2024
-
Mark
Modeling the Transport and Interaction of Paperboard ”Confetti” in Pipes
- Master (Two yrs)
-
Mark
Representative Volume Element for Modelling the In-Plane Mechanical Behaviour of Paperboard: Utilizing Microstructure from X-ray Tomography
- Prof. qual. >4 yrs
- 2023
-
Mark
In-plane Wetting in Packaging Material and its Consequences for Cap Performance
- Master (Two yrs)
- 2022
-
Mark
Validation of An Iteration Free Material Model for Paperboard (NEO)
- Prof. qual. >4 yrs
-
Mark
Strain Rate Characterization of Packaging Materials
- Master (Two yrs)
-
Mark
Mapping of Material & Conversion Parameters of Packaging Production – Boardio®
- Master (Two yrs)
-
Mark
Multiscale mechanical modeling of paperboard
- Prof. qual. >4 yrs
- 2021
-
Mark
Evaluation of post-consumer recycled materials for folding cartons: A sustainable packaging study
- Master (Two yrs)