Optical Link by Using Optical Wiring Method for Reducing EMI
(2008) Smart Structures, Devices, and Systems IV 7268.- Abstract
- A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy
assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and
susceptibility.
This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising... (More) - A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy
assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and
susceptibility.
This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the
following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a
substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring
link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)
directly connecting one end of the surface-finished optical transmission connection medium with the light source device
and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such
as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-
electronics), the purely optical part and optical link(interconnection) is free of these problems. 1
An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and
EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust
and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data
transmission rate without EMI problems. (Less)
Please use this url to cite or link to this publication:
https://lup.lub.lu.se/record/4732858
- author
- Cho, In-Kui ; Kwon, Jong-Hwa ; Choi, Sung-Woong ; Bondarik, Alexander LU ; Yun, Je-Hoon ; Kim, Chang-Joo ; Ahn, Seung-Beom ; Jeong, Myung-Yung and Park, Hyo Hoon
- organization
- publishing date
- 2008
- type
- Chapter in Book/Report/Conference proceeding
- publication status
- published
- subject
- keywords
- Interconnect, electromagnetic interference, chip-to-chip interconnection, metal electro-optical bench(MOB), optical interconnection technology, Plastic optical fiber(POF), EMI
- host publication
- [Host publication title missing]
- volume
- 7268
- pages
- 8 pages
- publisher
- SPIE
- conference name
- Smart Structures, Devices, and Systems IV
- conference location
- Melbourne, Australia
- conference dates
- 2008-12-09
- external identifiers
-
- scopus:62449093685
- ISBN
- 9780819475206
- DOI
- 10.1117/12.810220
- language
- English
- LU publication?
- no
- id
- 92447ddf-0258-4c30-955d-6eb4abc21db4 (old id 4732858)
- date added to LUP
- 2016-04-04 11:15:32
- date last changed
- 2022-01-29 21:36:24
@inproceedings{92447ddf-0258-4c30-955d-6eb4abc21db4, abstract = {{A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy<br/><br> assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and<br/><br> susceptibility.<br/><br> This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the<br/><br> following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a<br/><br> substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring<br/><br> link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)<br/><br> directly connecting one end of the surface-finished optical transmission connection medium with the light source device<br/><br> and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such<br/><br> as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-<br/><br> electronics), the purely optical part and optical link(interconnection) is free of these problems. 1<br/><br> An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and<br/><br> EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust<br/><br> and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data<br/><br> transmission rate without EMI problems.}}, author = {{Cho, In-Kui and Kwon, Jong-Hwa and Choi, Sung-Woong and Bondarik, Alexander and Yun, Je-Hoon and Kim, Chang-Joo and Ahn, Seung-Beom and Jeong, Myung-Yung and Park, Hyo Hoon}}, booktitle = {{[Host publication title missing]}}, isbn = {{9780819475206}}, keywords = {{Interconnect; electromagnetic interference; chip-to-chip interconnection; metal electro-optical bench(MOB); optical interconnection technology; Plastic optical fiber(POF); EMI}}, language = {{eng}}, publisher = {{SPIE}}, title = {{Optical Link by Using Optical Wiring Method for Reducing EMI}}, url = {{https://lup.lub.lu.se/search/files/5731591/4732859.pdf}}, doi = {{10.1117/12.810220}}, volume = {{7268}}, year = {{2008}}, }