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Optical Link by Using Optical Wiring Method for Reducing EMI

Cho, In-Kui; Kwon, Jong-Hwa; Choi, Sung-Woong; Bondarik, Alexander LU ; Yun, Je-Hoon; Kim, Chang-Joo; Ahn, Seung-Beom; Jeong, Myung-Yung and Park, Hyo Hoon (2008) Smart Structures, Devices, and Systems IV In [Host publication title missing] 7268.
Abstract
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy

assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and

susceptibility.

This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising... (More)
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy

assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and

susceptibility.

This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the

following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a

substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring

link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)

directly connecting one end of the surface-finished optical transmission connection medium with the light source device

and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such

as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-

electronics), the purely optical part and optical link(interconnection) is free of these problems. 1

An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and

EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust

and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data

transmission rate without EMI problems. (Less)
Please use this url to cite or link to this publication:
author
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
Interconnect, electromagnetic interference, chip-to-chip interconnection, metal electro-optical bench(MOB), optical interconnection technology, Plastic optical fiber(POF), EMI
in
[Host publication title missing]
volume
7268
pages
8 pages
publisher
SPIE
conference name
Smart Structures, Devices, and Systems IV
external identifiers
  • Scopus:62449093685
ISBN
9780819475206
DOI
10.1117/12.810220
language
English
LU publication?
no
id
92447ddf-0258-4c30-955d-6eb4abc21db4 (old id 4732858)
date added to LUP
2014-11-05 11:29:12
date last changed
2016-10-13 04:44:46
@misc{92447ddf-0258-4c30-955d-6eb4abc21db4,
  abstract     = {A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy<br/><br>
assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and<br/><br>
susceptibility.<br/><br>
This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the<br/><br>
following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a<br/><br>
substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring<br/><br>
link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)<br/><br>
directly connecting one end of the surface-finished optical transmission connection medium with the light source device<br/><br>
and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such<br/><br>
as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-<br/><br>
electronics), the purely optical part and optical link(interconnection) is free of these problems. 1<br/><br>
An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and<br/><br>
EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust<br/><br>
and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data<br/><br>
transmission rate without EMI problems.},
  author       = {Cho, In-Kui and Kwon, Jong-Hwa and Choi, Sung-Woong and Bondarik, Alexander and Yun, Je-Hoon and Kim, Chang-Joo and Ahn, Seung-Beom and Jeong, Myung-Yung and Park, Hyo Hoon},
  isbn         = {9780819475206},
  keyword      = {Interconnect,electromagnetic interference,chip-to-chip interconnection,metal electro-optical bench(MOB),optical interconnection technology,Plastic optical fiber(POF),EMI},
  language     = {eng},
  pages        = {8},
  publisher    = {ARRAY(0xadf0f60)},
  series       = {[Host publication title missing]},
  title        = {Optical Link by Using Optical Wiring Method for Reducing EMI},
  url          = {http://dx.doi.org/10.1117/12.810220},
  volume       = {7268},
  year         = {2008},
}