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Numerical Determination of Process Values Influencing the Surface Integrity in Grinding

Holtermann, R. ; Schumann, S. ; Zabel, Brian A. ; Biermann, D. and Menzel, A. LU (2016) 3rd CIRP Conference on Surface Integrity (CSI 2016) In Procedia CIRP 45. p.39-42
Abstract

Internal traverse grinding with electroplated cBN wheels using high-speed process conditions combines high material removal rates and a high surface quality of the workpiece in one single grinding stroke. In order to capture the macroscopic and mesoscopic thermo-mechanical loads onto the workpiece during internal traverse grinding, numerical simulations are conducted at the two scales. This results in a hybrid approach coupling two finite element models with a geometric kinematic simulation. The article focuses on the influence of multiple grain engagements onto a surface layer region using a two-dimensional chip formation simulation.

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author
; ; ; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
Finite Element Method, Geometric modelling, Grinding, Multi-scale modelling
host publication
3rd CIRP Conference on Surface Integrity
series title
Procedia CIRP
volume
45
pages
4 pages
publisher
Elsevier
conference name
3rd CIRP Conference on Surface Integrity (CSI 2016)
conference location
Charlotte, United States
conference dates
2016-06-08 - 2016-06-10
external identifiers
  • scopus:84978763759
  • wos:000417326500010
ISSN
2212-8271
ISBN
9781510824621
DOI
10.1016/j.procir.2016.02.072
language
English
LU publication?
yes
id
2da50d82-4c39-4dda-9c7c-a2f0de2cec51
date added to LUP
2017-02-22 15:32:44
date last changed
2025-10-14 10:20:36
@inproceedings{2da50d82-4c39-4dda-9c7c-a2f0de2cec51,
  abstract     = {{<p>Internal traverse grinding with electroplated cBN wheels using high-speed process conditions combines high material removal rates and a high surface quality of the workpiece in one single grinding stroke. In order to capture the macroscopic and mesoscopic thermo-mechanical loads onto the workpiece during internal traverse grinding, numerical simulations are conducted at the two scales. This results in a hybrid approach coupling two finite element models with a geometric kinematic simulation. The article focuses on the influence of multiple grain engagements onto a surface layer region using a two-dimensional chip formation simulation.</p>}},
  author       = {{Holtermann, R. and Schumann, S. and Zabel, Brian A. and Biermann, D. and Menzel, A.}},
  booktitle    = {{3rd CIRP Conference on Surface Integrity}},
  isbn         = {{9781510824621}},
  issn         = {{2212-8271}},
  keywords     = {{Finite Element Method; Geometric modelling; Grinding; Multi-scale modelling}},
  language     = {{eng}},
  pages        = {{39--42}},
  publisher    = {{Elsevier}},
  series       = {{Procedia CIRP}},
  title        = {{Numerical Determination of Process Values Influencing the Surface Integrity in Grinding}},
  url          = {{http://dx.doi.org/10.1016/j.procir.2016.02.072}},
  doi          = {{10.1016/j.procir.2016.02.072}},
  volume       = {{45}},
  year         = {{2016}},
}