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A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu6Sn5

Jacobsson, Erik LU ; Hallberg, Håkan LU orcid ; Hektor, Johan LU ; Iyengar, Srinivasan LU and Ristinmaa, Matti LU orcid (2024) In Computational Materials Science 244.
Abstract

This paper presents a sharp interface formulation for modelling diffusional phase transformations. Grain boundary motion is, in accordance with diffusional phase transformation kinetics, determined by the amount of flux towards the interface and is formulated in a level set framework. This approach enables a computational efficiency that can be expected to be higher than what can be achieved with conventional phase field methods. Compatibility of the interfaces is obtained through an interface reconstruction process, in which the locations of triple junction points are also determined. To ensure local equilibrium and a continuous chemical potential across the interfaces, the chemical composition is prescribed at the phase interfaces.... (More)

This paper presents a sharp interface formulation for modelling diffusional phase transformations. Grain boundary motion is, in accordance with diffusional phase transformation kinetics, determined by the amount of flux towards the interface and is formulated in a level set framework. This approach enables a computational efficiency that can be expected to be higher than what can be achieved with conventional phase field methods. Compatibility of the interfaces is obtained through an interface reconstruction process, in which the locations of triple junction points are also determined. To ensure local equilibrium and a continuous chemical potential across the interfaces, the chemical composition is prescribed at the phase interfaces. The presented model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 for a system with Sn electroplated on a Cu substrate. A finite strain formulation is incorporated into the model to investigate the effects of the volume change resulting from the IMC formation. In this formulation, the Cu and Sn phases are allowed to deform plastically. The numerical simulations demonstrate IMC growth rates in agreement with experimental measurements. Moreover, the IMC evolves into a scallop-like morphology, consistent with experimental observations.

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author
; ; ; and
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
CuSn, Diffusional phase transformations, Finite strain plasticity, Intermetallic compound growth, Level set
in
Computational Materials Science
volume
244
article number
113284
publisher
Elsevier
external identifiers
  • scopus:85200797788
ISSN
0927-0256
DOI
10.1016/j.commatsci.2024.113284
language
English
LU publication?
yes
additional info
Publisher Copyright: © 2024 The Author(s)
id
bdcdd65a-4574-4f37-91c6-f9cf77ea0f8e
date added to LUP
2024-08-21 19:27:27
date last changed
2024-08-23 09:38:10
@article{bdcdd65a-4574-4f37-91c6-f9cf77ea0f8e,
  abstract     = {{<p>This paper presents a sharp interface formulation for modelling diffusional phase transformations. Grain boundary motion is, in accordance with diffusional phase transformation kinetics, determined by the amount of flux towards the interface and is formulated in a level set framework. This approach enables a computational efficiency that can be expected to be higher than what can be achieved with conventional phase field methods. Compatibility of the interfaces is obtained through an interface reconstruction process, in which the locations of triple junction points are also determined. To ensure local equilibrium and a continuous chemical potential across the interfaces, the chemical composition is prescribed at the phase interfaces. The presented model is used to study the growth of the intermetallic compound (IMC) Cu<sub>6</sub>Sn<sub>5</sub> for a system with Sn electroplated on a Cu substrate. A finite strain formulation is incorporated into the model to investigate the effects of the volume change resulting from the IMC formation. In this formulation, the Cu and Sn phases are allowed to deform plastically. The numerical simulations demonstrate IMC growth rates in agreement with experimental measurements. Moreover, the IMC evolves into a scallop-like morphology, consistent with experimental observations.</p>}},
  author       = {{Jacobsson, Erik and Hallberg, Håkan and Hektor, Johan and Iyengar, Srinivasan and Ristinmaa, Matti}},
  issn         = {{0927-0256}},
  keywords     = {{CuSn; Diffusional phase transformations; Finite strain plasticity; Intermetallic compound growth; Level set}},
  language     = {{eng}},
  publisher    = {{Elsevier}},
  series       = {{Computational Materials Science}},
  title        = {{A level set approach to modelling diffusional phase transformations under finite strains with application to the formation of Cu<sub>6</sub>Sn<sub>5</sub>}},
  url          = {{http://dx.doi.org/10.1016/j.commatsci.2024.113284}},
  doi          = {{10.1016/j.commatsci.2024.113284}},
  volume       = {{244}},
  year         = {{2024}},
}