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- 2016
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Mark
Defect sensitivity of single-crystal nano-sized Cu beams
(
- Contribution to journal › Article
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Mark
Necking in single-crystal fcc copper nanobeams
2016) Nordic Seminar in Computationa MEchanics(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
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Mark
Stress and displacement configurations in the vicinity of a void in a nanometer copper strip
(
- Contribution to journal › Article
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Mark
Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
2016) 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE In Proseeding to the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
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Mark
Tensile behavior of single-crystal nano-sized copper beams with voids
2016) 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE In Proceedings to the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
- 2015
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Mark
POISSON'S RATIO AT NANOSCALE IN SINGLE-CRYSTAL FCC COPPER
2015) NSCM-28(
- Contribution to conference › Paper, not in proceeding
- 2014
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Mark
Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics
(
- Contribution to journal › Article
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Mark
Fatigue testing and microstructural characterization of tungsten heavy alloy Densimet 185
(
- Contribution to journal › Article
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Mark
Stress analysis of highly constrained copper strips with through crack shaped voids using molecular dynamics
2014) 7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7) 592-593. p.43-46(
- Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
-
Mark
Indentation of thin copper film using peridynamics
2014) Nordic Seminar on Computational Mechanics, 2014(
- Contribution to conference › Paper, not in proceeding