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Numerical Determination of Process Values Influencing the Surface Integrity in Grinding

Holtermann, R.; Schumann, S.; Zabel, Brian A.; Biermann, D. and Menzel, A. LU (2016) In Procedia CIRP 45. p.39-42
Abstract

Internal traverse grinding with electroplated cBN wheels using high-speed process conditions combines high material removal rates and a high surface quality of the workpiece in one single grinding stroke. In order to capture the macroscopic and mesoscopic thermo-mechanical loads onto the workpiece during internal traverse grinding, numerical simulations are conducted at the two scales. This results in a hybrid approach coupling two finite element models with a geometric kinematic simulation. The article focuses on the influence of multiple grain engagements onto a surface layer region using a two-dimensional chip formation simulation.

Please use this url to cite or link to this publication:
author
organization
publishing date
type
Contribution to journal
publication status
published
subject
keywords
Finite Element Method, Geometric modelling, Grinding, Multi-scale modelling
in
Procedia CIRP
volume
45
pages
4 pages
publisher
Elsevier
external identifiers
  • scopus:84978763759
ISSN
2212-8271
DOI
10.1016/j.procir.2016.02.072
language
English
LU publication?
yes
id
2da50d82-4c39-4dda-9c7c-a2f0de2cec51
date added to LUP
2017-02-22 15:32:44
date last changed
2017-10-01 05:30:57
@article{2da50d82-4c39-4dda-9c7c-a2f0de2cec51,
  abstract     = {<p>Internal traverse grinding with electroplated cBN wheels using high-speed process conditions combines high material removal rates and a high surface quality of the workpiece in one single grinding stroke. In order to capture the macroscopic and mesoscopic thermo-mechanical loads onto the workpiece during internal traverse grinding, numerical simulations are conducted at the two scales. This results in a hybrid approach coupling two finite element models with a geometric kinematic simulation. The article focuses on the influence of multiple grain engagements onto a surface layer region using a two-dimensional chip formation simulation.</p>},
  author       = {Holtermann, R. and Schumann, S. and Zabel, Brian A. and Biermann, D. and Menzel, A.},
  issn         = {2212-8271},
  keyword      = {Finite Element Method,Geometric modelling,Grinding,Multi-scale modelling},
  language     = {eng},
  pages        = {39--42},
  publisher    = {Elsevier},
  series       = {Procedia CIRP},
  title        = {Numerical Determination of Process Values Influencing the Surface Integrity in Grinding},
  url          = {http://dx.doi.org/10.1016/j.procir.2016.02.072},
  volume       = {45},
  year         = {2016},
}