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Electro-thermal Models of Power Modules for Stochastic Optimization of Inverters

Byden, Hannes LU ; Bourniche, Eric ; Domingues, Gabriel LU ; Alakula, Mats LU orcid ; Leblay, Arnaud and Marquez, Fran LU orcid (2023) 2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023
Abstract

Stochastic optimization methods are commonly used in the design process of power electronic systems. These require models of crucial parts of the system which are both scalable and computationally efficient. This paper presents thermal models for traction inverter power modules based on scalable chip area that provide high speed of execution and accuracy. The thermal model includes chip-chip interaction, heat spreading and the effects of chip density inside the package.

Please use this url to cite or link to this publication:
author
; ; ; ; and
organization
publishing date
type
Chapter in Book/Report/Conference proceeding
publication status
published
subject
keywords
Optimzation, power module, scalable model, thermal model
host publication
2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023
publisher
IEEE - Institute of Electrical and Electronics Engineers Inc.
conference name
2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023
conference location
Detroit, United States
conference dates
2023-06-21 - 2023-06-23
external identifiers
  • scopus:85168241667
ISBN
9798350397420
DOI
10.1109/ITEC55900.2023.10187060
language
English
LU publication?
yes
id
4ab74c1e-9df6-4f27-824b-50ade9b1db24
date added to LUP
2023-11-13 13:11:04
date last changed
2023-11-21 10:02:19
@inproceedings{4ab74c1e-9df6-4f27-824b-50ade9b1db24,
  abstract     = {{<p>Stochastic optimization methods are commonly used in the design process of power electronic systems. These require models of crucial parts of the system which are both scalable and computationally efficient. This paper presents thermal models for traction inverter power modules based on scalable chip area that provide high speed of execution and accuracy. The thermal model includes chip-chip interaction, heat spreading and the effects of chip density inside the package.</p>}},
  author       = {{Byden, Hannes and Bourniche, Eric and Domingues, Gabriel and Alakula, Mats and Leblay, Arnaud and Marquez, Fran}},
  booktitle    = {{2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023}},
  isbn         = {{9798350397420}},
  keywords     = {{Optimzation; power module; scalable model; thermal model}},
  language     = {{eng}},
  publisher    = {{IEEE - Institute of Electrical and Electronics Engineers Inc.}},
  title        = {{Electro-thermal Models of Power Modules for Stochastic Optimization of Inverters}},
  url          = {{http://dx.doi.org/10.1109/ITEC55900.2023.10187060}},
  doi          = {{10.1109/ITEC55900.2023.10187060}},
  year         = {{2023}},
}